Blogs Archives - Page 59 of 75

3D In Context View all

An aerial view from February 2024 shows construction progress at Intel's Ohio One campus of nearly 1,000 acres in Licking County, Ohio. Intel announced plans in January 2022, to invest more than $20 billion in the construction of two new leading-edge chip factories in Ohio. The company broke ground in September 2022. The investment will serve the needs of Intel Foundry customers as part of the company’s IDM 2.0 strategy. (Credit: Intel Corporation)

Taking Stock of Global Investments in Semiconductor Manufacturing

Apr 10, 2024 · By Dean Freeman · 3D In Context

The geopolitical race to take the lead in semiconductors is heating up as global investments in semiconductor manufacturing take hold. Several weeks ago, the Department of Commerce finally made a big US CHIPS Act award, giving Intel $8.5 billion of the allotted 38 billion set to go to semiconductor manufacturing....

e-waste recycling: Source U.S PRIG Education Fund

Electronics Recycling: There’s Gold in Those Old Electronic Gadgets!

Mar 21, 2024 · By Dean Freeman · 3D In Context

When you replace your PC with an AI-enabled one, will you make sure your old device goes into an electronics recycling program? In November of 2023, I wrote about artificial intelligence (AI) personal computers (PCs) possibly being a growth driver of the 2024 PC and semiconductor growth. Our trusty editor...

Will the Intel Foundry Model Succeed?

Mar 13, 2024 · By Dean Freeman · 3D In Context

The foundry world has been big news in the past few weeks. TSMC started up the Kumamoto Fab, Japan’s leading-edge semiconductor technology center, partnering with Tenstorrent on RISC-V and chiplets to be manufactured at Rapidus. The biggest non-surprise news flash was the roll-out of Intel’s Foundry Direct Connect, which they...

What the Ski and Semiconductor Industries Have in Common

Feb 22, 2024 · By Dean Freeman · 3D In Context

From November to April for the past seven years, I have spent a considerable amount of time on the snow as a ski instructor. In 2019 the International Ski and Snowboard Federation implemented a ban on fluorinated waxes that took place in July of 2021. The change left skiers scrambling,...

Francoise in 3D View all

IMAPS DPC 2024 Makes Advanced Packaging Fun Again!

Mar 26, 2024 · By Francoise von Trapp · Blogs

At last week’s International Microelectronics and Packaging Society’s Device Packaging Conference, (IMAPS DPC 2024) we didn’t need TrendForce to tell us that advanced packaging is the hottest technology in the semiconductor industry. We just needed to look at the record attendance of more than 700 advanced packaging enthusiasts who turned...

ISS Europe 2024: Succeeding in an Evolving Global Semiconductor Landscape

Mar 11, 2024 · By Francoise von Trapp · Blogs

When I interview members for the 3D InCites Podcast at industry events, I often ask them, “What did you come here to learn?” As this is my first time at ISS Europe, I asked myself that question. Here’s what I came up with. I attended ISS Europe 2024 to learn...

Announcing the Winners of the 2024 3D InCites Awards

Feb 06, 2024 · By Francoise von Trapp · Blogs

It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to improve the program. We intended to provide more opportunities for participation across the heterogeneous integration supply chain, and we are happy with the outcome. A special thank you to the...

Leading The Charge to One Trillion Dollars

Jan 23, 2024 · By Francoise von Trapp · Blogs

A Conversation About Leadership with SEMI CEO Ajit Manocha For the past few years, we’ve heard semiconductor market analysts prognosticate that based on estimated demand, semiconductors have the potential to become a $1Trillion industry in the next 7-10 years. This number is based on analysts’ projections of driving markets including...

From Different Dimensions View all

EV Group: More than 40 Years of Growth Fueled by 3D/Heterogeneous Integration

Apr 04, 2024 · By Paul Lindner · Blogs

Riding the 3D/Heterogeneous Integration Wave For decades, the ability to achieve the necessary power, performance, area, and cost (PPAC) in semiconductor manufacturing had been largely driven by 2D design rule shrinks enabled through advances in lithography. In recent years, however, the rising costs and complexity associated with 2D shrinks have...

March Member Highlights: Anniversaries, Events, Collaborations, New Products, and More

Mar 28, 2024 · By Avery Gerber · Blogs

March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance technology, foster education, and address sustainability challenges. From groundbreaking product launches to strategic partnerships and workforce development initiatives, here are the highlights of 3D InCites members’ industry news, events, and...

Driving Into the Future: The Next Phase in Automotive Compute Package Adoption

Mar 18, 2024 · By Prasad Dhond · Blogs

Automotive compute processors are rapidly adopting advanced process nodes. NXP announced the development of 5nm automotive processors in 2020 [1], Mobileye announced EyeQ Ultra using 5nm technology during CES 2022 [2], and TSMC announced its “Auto Early” 3nm processes in 2023 [3]. In the past, the automotive industry was slow...

Sustainablity 101: Build a Better ESD Bag

Mar 14, 2024 · By Julia Freer Goldstein · Blogs

When I worked for Advanced Packaging magazine in the early 2000s, we sometimes got pitches from companies that made cardboard boxes or foam cushioning materials. Their spokespeople obviously had not read the magazine or looked beyond the word “packaging” in the title. We ignored those pitches. However, many levels of...

Packaging IFTLE View all

Intel CEO Pat Gelsinger (left) speaks with U.S. President Joe Biden during a tour of an Intel semiconductor factory in Chandler, Arizona, on Wednesday, March 20, 2024. The tour stopped to inspect wafers representing Intel’s goal of completing five process nodes in four years. Earlier that day, the Biden-Harris Administration announced that Intel and the U.S. Department of Commerce had signed a non-binding preliminary memorandum of terms for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. (Credit: Intel Corporation)

IFTLE 589: Intel Gets CHIPS Act Funding; Raytheon and AMD Partner on Multi-Chip Package

Apr 02, 2024 · By Phil Garrou · Blogs

The Department of Commerce (DoC) has announced Intel as the fourth program it will fund under the CHIPS and Science Act CHIPS for America includes the CHIPS Program Office (responsible for manufacturing incentives), and the CHIPS Research and Development Office, (responsible for R&D programs). Both activities sit within the National...

IFTLE 588: CHIPS NAPMP Materials & Substrates Program

Mar 27, 2024 · By Phil Garrou · Blogs

The Creating Helpful Innovations in the Production of Semiconductors (CHIPS) workforce initiatives are shown in Figure 1: The CHIPS vision for success for the National Advanced Packaging Manufacturing Program (NAPMP) is to establish U.S. leadership in advanced packaging and provide the technology needed for packaging manufacturing in the U.S. Ex-IBM...

An Intel engineer holds a test glass core substrate panel at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)

IFTLE 587: Intel Glass Core Substrate Update

Mar 19, 2024 · By Phil Garrou · Blogs

In late Feb INEMI hosted a Packaging Tech Topic Webinar: Glass Substrates for Advanced Packaging which was presented by Dr. Dilan Seneviratne and Dr. Gang Duan of Intel Corporation. Dilan Seneviratne is a Principal Engineer and Director of Dielectrics and Surface Prep Area within Intel’s Substrate Packaging Technology Development organization....

IFTLE 586: US CHIPS Act Monies Begin to Flow

Mar 05, 2024 · By Phil Garrou · Blogs

US Chip Fabrication, Packaging & Assembly Industry In August 2023, one year after the U.S. CHIPs Act was signed into law, the White House announced that over 460 companies had already submitted statements of interest to receive funding. GlobalFoundries The U.S. Dept of Commerce has announced $1.5B in direct funding...

SemiSisters View all

Wear A Dress To Work and Other Ways to Foster Gender Gap Allyship

Nov 09, 2023 · By Francoise von Trapp · Blogs

I have attended my share of DEI and allyship-focused events in the past few years attended by both women and men. In fact, I have moderated a few and recorded several for the 3D InCites podcast. But this was my first SEMI Women in Semiconductors (SEMI WIS) event, and it...

Why Men Should Attend Women-Focused Events like Women in Semiconductors

Sep 25, 2023 · By Margaret Kindling · Blogs

In a recent LinkedIn post about The Barbie Movie, former Women in Semiconductors (WiS) committee co-chair Garima Gautam wrote that “every year there are multiple industry conferences that have topics like gender bias, women in the workplace and women in the semiconductor industry. We have struggled to get the other half of our workforce...

Hiring and Retaining a Diverse Workforce

May 31, 2023 · By DECA · Blogs

The CHIPS and Science Act aims to bring semiconductor research & development and manufacturing back to U.S. soil. Not only will this make the U.S. less reliant on the international supply chain, but it is estimated that this investment in onshore semiconductor and research facilities will create over half a...

SEMI Foundation WIS Event Focuses on Bridging the Gender Gap Through Allyship

May 03, 2023 · By Emerald Greig · Blogs

I attended my first SEMI Foundation-organized Women in Semiconductors (WIS) event on May 1st. It was held in conjunction with the Advanced Semiconductor Manufacturing Conference (ASMC) in Saratoga Springs, NY. I really didn’t know what to expect but I know I wasn’t expecting standing-room-only with 200 people attending. The other...