IFTLE 591: TSMC AZ & Samsung get CHIPS Money; IMAPS Hosts 2nd Annual Onshoring Conference
Apr 23, 2024 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts - Page 56
ECTC 2014: Bridging the Gap to 2.5D and 3D
Each year since I first attended the IEEE Electronic Component Technology Conference (ECTC) in 2009, the keynotes, panels and papers...
3D NAND Flash – Schiltron’s Answer
It probably appears that the only 3D technologies vying for 2D NAND’s crown are V-NAND from Samsung and p-BiCS from...
SSEC: Innovators in Single Wafer Wet Processing Tools
49 years ago, Solid State Equipment, LLC (SSEC) opened its doors with its first piece of semiconductor equipment; a seam...
News of 3D NAND Fab Construction: A sign of Progress or a PR Ruse?
While I don’t claim to be an expert in 3D NAND technologies, I do keep my eye on what’s happening...
Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?
Years ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half...
An Open Letter to Chip and System-level Designers Regarding 3D Integration
Dear Chip and System-level Designers, Allow me to introduce myself. My name is Françoise von Trapp, and I am known...
Process Improvements Target 3D IC Cost of Ownership
Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s...
Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D Interposers
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)...
3D IC Adoption: What’s it going to Take?
If, as we heard at last week’s 3D IC Forum at SEMICON Singapore, that technology challenges and cost are no...
SEMICON Singapore 2014: A Rosy Outlook for 2.5D and 3D ICs
This week, at the invitation of SEMI Southeast Asia, I made the monumental trek from Phoenix, AZ to Singapore to...
A Sneak Peek at IITC and AMC 2014
The recent announcement of the International Interconnect Technology Conference (IITC), combined with the Advanced Metallization Conference (AMC) in the Double...
GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?
Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at...
Oerlikon Systems: Pragmatic and Poised for 3D IC High Volume Manufacturing
In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state into one of the...
When You Come to a Fork In the Road, Take It
When Yogi Berra made this very wise statement, he certainly didn’t mean to give specific advice what to choose. I...
Cascade Microtech Breaks Through the Barriers of 3D Test
For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has...
3D Workshop Panel Discussion Focuses on 3D Standards and EDA Tool Readiness
Are slow standardization and CAD-tool development hindering the progress of 3D IC design and integration? This was the topic of discussion...
Calling for A Collaborative Semiconductor Supply Chain Comes at DATE 2014
Design and Test Europe 2014 (DATE 2014), which took place in Dresden, March 24-28 2014, brought together semiconductor design and test...
The Fraunhofer Cluster for 3D Integration Looks at the Big Picture
Two years ago, I visited to Fraunhofer IZM-ASSID, located in Dresden, Germany; to see first-hand what this particular arm of...
Silicon Saxony: Leading the Charge in More than Moore
Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development...
