Sustainability 101: Refuse, Reduce, Repair, Refurbish, Rework
Apr 16, 2024 · By Julia Freer Goldstein · Blogs, From Different Dimensions
Latest Posts - Page 9
VLSI 2020: 3D Continues to Dominate Advanced Semiconductor Technology
As a process geek, The Symposia on VLSI Technology and Circuits has long been one of my favorite conferences. The...
Industry Outlook: What Goes Down Must Come Up
The GDP is down, the stock market is up, unemployment, at least in the USA, is confused, so what is...
Semiconductor Backend Processes: Additional SEMI Standards Related to GEM
Background In a few previous blogs, I shared how the relatively new SEMI Advanced Backend Factory Integration (ABFI) task force...
Stay Virtually Connected with Your Industry Colleagues and Favorite Topics at ECTC 2020
On behalf of the entire Program and Executive Committees, it is my pleasure to invite and welcome all of you...
I’m Not Thrilled to Write this Blog Post
One of the ongoing travesties in public relations? Press release quotes. Looked upon as a necessary evil by most writers,...
TSMC Tales: Building 5nm Fab in Arizona; Cancelling New Huawei Orders
Lots of news over the weekend regarding TSMC. The big news is that TSMC is projected to build its first...
Temporary Wafer Bonding System Is Based On Electrostatics, Not Adhesives
Temporary wafer bonding is widely employed in semiconductor device fabrication and in semiconductor device packaging applications, particularly now that changes...
Chiplets: The New Era Begins
The semiconductor industry has entered a new era and the role of design including the package has become increasingly important....
Chiplets Promise to put Moore’s Law Back on Track
Moore’s Law may not be dead, but at 55 years old, it’s certainly feeling its age, with the pace of...
Commerce Department Tightens the Screws on the US Semiconductor Industry
On April 28, the commerce department issued the following news release that could deeply impact the US semiconductor industry: “The...
Six Ways to Repurpose Your Tradeshow Investment
Like all global industries, the tech industry is being challenged in unprecedented ways as the outbreak of the novel coronavirus...
Recent Achievements in SEMI Standards
The first SEMI Standards Committee was formed in 1973 to address silicon wafer dimensional specifications. At the time, there was...
Semiconductor Industry Collaboration Becomes More Critical as Technologies Converge
Perhaps more than at any point in the history of the semiconductor industry, the manufacturing and design supply chain is...
COVID-19 and Semiconductor Recovery: What Does the Future Hold?
While the fog surrounding COVID-19 is still heavy out there, over the past week it has started to clear enough...
The More Things Change, The More They Stay The Same
By David Francis; Director of Product Management, Cimetrix In the early 1990’s I worked with companies like Motorola, Wacker Siltronics,...
COVID-19: What Can We Learn from China’s Experience?
Across the world, citizens are settling into a temporary new normal necessitated by efforts to slow the spread of the...
Heterogeneous Integration Technologies for Moore’s Law 2.0 and Beyond
Despite travel restrictions due to the Coronavirus, Dr. Douglas Yu, Vice President of R&D for TSMC gave a keynote via...
Why implement a SECS GEM driver?
A SECS GEM driver can be looked at from a factory or equipment supplier perspective. I will discuss both of...
Big Data and Beyond: PTC Summit Examines AI and ML for Smart City Applications
The problem at its most succinct: “A piece of equipment will deteriorate much more predictably than a human body does.”...
