Awards-Winner

The MSEC 2018 Technology Showcase: Who Owns the Data?

The MSEC 2018 Technology Showcase: Who Owns the Data?

The competition was fierce and the stakes high for the annual MSEC 2018 technology showcase. which took place during the MEMS and Sensors Executive Congress, in Napa CA. The winner gets a free table next year and is expected to share their progress. After a rapid-fire session of presentations and time to visit demo tables, their fate is in the hands of the attendees who have 24 hours to vote for t... »

Mentor Graphics: Xpedition Package Integrator

Mentor Graphics: Xpedition Package Integrator

Xpedition® Package Integrator provides a holistic co-design methodology that automates planning and optimization of connectivity from a chip through multiple packaging variables, while targeting multiple PCB platforms. Engineers can quickly and easily assemble complete cross-domain systems (IC, package & board) and drive ball map plans and pin optimization through a rule-based methodology. Te... »

Dow Corning: Thermally Conductive Gel TC-3040

Dow Corning: Thermally Conductive Gel TC-3040

TC-3040 is designed for advanced flip chip devices requiring improved heat dissipation.  The material features a combination of low modulus and high elongation – enabling it to accommodate warpage-induced stresses.  Key to the improved thermal performance : low contact resistance that silicones are known for, along with proprietary filler technology. Testimonial While advanced 2.5D or 3D... »

KLA-Tencor: CIRCL-AP™

KLA-Tencor: CIRCL-AP™

CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced wafer level packaging (AWLP) process control. The CIRCL-AP provides production-proven, high sensitivity monitoring capability for multiple AWLP applications including 2.5D/3D integration, wafer-level chip scale packaging and fan-out wafer-level packag... »

Amkor: SLIM

Amkor: SLIM

Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level of integration by use of back-end-of-line technology combined with assembly-based fan-out architectures.  It has optimal registration, 3D access to top and bottom side of package and the finest line RDL capability found in packaging today! Testim... »

Xilinx: Ultrascale VU440 3D FPGA

Xilinx: Ultrascale VU440 3D FPGA

The Xilinx Ultrascale VU440 3D FPGA is constructed using “Xinterposer” 3D IC technology jointly developed by Xilinx and TSMC. It uses a low-k dielectric chip fabricated on 20nm silicon node with a total of 375,000 micron bumps stacked on 25mm x 45mm silicon interposer and assembled with CoWoS. The composite 3D FPGA consists of approximately 19 billion transistors. Testimonial: The Ultrasca... »

EV Group: GEMINI®FB XT Automated Production Fusion Bonding System

EV Group: GEMINI®FB XT Automated Production Fusion Bonding System

The GEMINI®FB XT fusion wafer bonding platform features up to a 3X improvement in wafer-to-wafer bond alignment accuracy as well as a 50% increase in throughput over the previous industry benchmark platform. These performance breakthroughs clear several key hurdles to the industry’s adoption of 3D-IC/TSV technology. Testimonial According to the ITRS, high-density TSV applications require wa... »