Awards-Manufacturing Equipment

Lam Research: SABRE 3D

Lam Research: SABRE 3D

SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications.  This product leverages proprietary front-end manufacturing technology and offers market-specific solutions for copper pillar and through-silicon via (TSV) fabrication.  SABRE 3D offers industry-leading throughput along with reduced cost of consumabl... »

Nordson ASYMTEK: Programmable Tilt + Rotate 5-Axis Fluid Dispenser

Nordson ASYMTEK: Programmable Tilt + Rotate 5-Axis Fluid Dispenser

Nordson ASYMTEK’s programmable Tilt + Rotate 5-Axis Fluid Dispenser dispenses using 5 axes instead of 3. The X and Y tilt enables dispensing from a vertical position, varying tilt angles to all sides of a component and up to the top of a 3D stacked die with high precision and positional accuracy. Testimonial Jet dispensing of capillary underfill fluid is a standard process for producing semicond... »

SPTS: Sigma fxP PVD with Multi-Wafer Degas

SPTS: Sigma fxP PVD with Multi-Wafer Degas

SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It utilizes batch degas technology that can improve Rc whilst maintaining high throughputs, despite the outgassing challenges posed from the increasing use of organics, such as mold in Fan-Out WLP. Testimonial Fan-Out Wafer Level Packaging (FOWLP) technology is an increasingly popula... »

EV Group: GEMINI®FB XT Automated Production Fusion Bonding System

EV Group: GEMINI®FB XT Automated Production Fusion Bonding System

The GEMINI®FB XT fusion wafer bonding platform features up to a 3X improvement in wafer-to-wafer bond alignment accuracy as well as a 50% increase in throughput over the previous industry benchmark platform. These performance breakthroughs clear several key hurdles to the industry’s adoption of 3D-IC/TSV technology. Testimonial According to the ITRS, high-density TSV applications require wa... »