Awards-Inspection/Metrology Tools

KLA-Tencor: CIRCL-AP™

KLA-Tencor: CIRCL-AP™

CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced wafer level packaging (AWLP) process control. The CIRCL-AP provides production-proven, high sensitivity monitoring capability for multiple AWLP applications including 2.5D/3D integration, wafer-level chip scale packaging and fan-out wafer-level packag... »