Value Chain

3D TSV Summiit

European 3D TSV Summit: But Wait, There’s More!

Day Two of the European 3D TSV Summit dawned bright and clear, with such a spectacular view of the nearby French Alps that it took real commitment to stay indoors and focus on the task at hand. But I have to admit that for the most part, it was worth the sacrifice to hear what this collection of speakers had to say. Georg Kimmich, head of Silicon Packaging R&D at ST-Ericsson delivered a dose o... »

MonolithIC 3D's PDN concept f removing heat from 3D ICs.

Tying up 2012 3D IC Loose Ends

I don’t know about you, but I always find that amidst the holiday hubbub, the really important stuff gets shoved aside and falls through the cracks. Just in case you missed them, here are some good 3D related posts that may have been lost in the December race to “get it all done” so we could enjoy the holidays. On the topic of the 3D IC supply chain, SemiMD’s Mark LePedus wrote a comprehen... »

3D TSVs: Will Europe Lead the Way?

The first European 3D TSV Summit (January 22-23, 2013) hasn’t even happened yet, and already its intended message is becoming clear: Europe is ready to tackle those remaining issues and lead the world down the home stretch. It makes sense, since Europe’s R&D centers (imec, CEA Leti, Fraunhofer IZM) has been leading the way from the beginning, its foundries and IDMs (ST Microelectronics an... »

“Known Good Die” has a new name

After 20 years of chasing elusive Known Good Die (KGD) to achieve high yielding advanced interconnect technologies, the semiconductor industry has come to the conclusion that its time to take a different approach. It’s called Probably Good Die, and when it comes to 2.5D and 3D ICs, particularly for Memory, it’s a means to an end. At Known Good Die 2012: Reducing Costs through Yield Optimizatio... »

3D Technology Features in Review

The latest digital issues of Chip Scale Review and  iMicronews’ 3D Packaging magazines hit the virtual “stands” last week, and perhaps in honor if the 3D ASIP Conference that gets underway later this week, there are some hot new 3D technologies being featured. But first, to bring everyone up to speed, Jan Vardaman and Linda Mathew, TechSearch International, co-authored an editorial titled ... »

Tezzaron, Novati and 3D ICs: They’re doing it in the USA

While everyone’s waiting for the big memory houses like Micron and Samsung, and IDMS and foundries like IBM and TSMC to announce they are ramping to high volume manufacturing (HVM) with 3D ICs, deep in the heart of Texas, it’s already happening in low volumes for custom applications thanks to Tezzaron Semiconductor and its recent acquisition, Novati Technologies (formerly SVTC Technologies). A... »

Just another 3D Monday

For me, Mondays are about regrouping, getting out of weekend head and into what’s going on in the 3D world. (I confess, I do leave my work at the office!) Mostly I cruise around looking to be inspired. Here’s what was waiting for me today. Symmetry is an online magazine I’ve never heard of before; probably because it’s about particle physics and how it relates to other aspects of life and »

SEMICON Taiwan’s 3D Tech Forum: Were You There?

I didn’t make it to the SEMICON Taiwan SiP Global Summit this year and was hoping to find some coverage by other journalists so that I could at least curate and share the information on the 3D IC Technology Forum. Unfortunately, I didn’t see anything posted on the topic, but Dan Tracy of SEMI was kind enough to share several presentations so I could review and summarize them for 3D InCites. Th... »

3D in the iPhone 5 and Other Teardown Discoveries

“It’s just like peeling a banana” reads the caption on one  teardown photo describing the careful dissection of the iPhone 5. . But if you really want to see how it was done, check out this initial teardown video produced by iFixit.  It’s been 3 days since Chipworks tweeted anything interesting about the iPhone 5. The last was to ID the source of the A6 processor – which they’ve c... »

SEMICON Europa 2012 Focuses on Materials, 3D ICs, and 450mm

SEMICON Europa got underway yesterday, and reports from the event point to new materials, 450mm and 3D ICs as the key topics – all from the European perspective. According to SEMI Europe President, Heinz Kundert, Europe has reached a critical crossroads where its very future as a global competitor seems to hinge on making it in micro- and nano-electronics. "Europe must not risk the walking away ... »

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