Value Chain

A*STAR IME, STATS ChipPAC and Qualcomm collaborate to develop low cost interposer technology

A*STAR IME, STATS ChipPAC and Qualcomm collaborate to develop low cost interposer technology

Singapore 29 May, 2013– Singapore’s A*STAR Institute of Microelectronics (IME), Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Incorporated, and STATS ChipPAC have announced a collaboration to develop technology building blocks for Low Cost Interposers (LCI) for 2.5D ICs. “2.5D/3D IC technology provides ample opportunities to further increase functionality and perf... »

3D IC Business Model: A Customer Decision

3D IC Business Model: A Customer Decision

After more than a year of touting the turnkey model, even TSMC is jumping on board the collaboration bandwagon for manufacturing 2.5D and 3D ICs at high volume. This revelation came this week at ECTC 2013 (May 28-31, Las Vegas) from TSMC’s Jerry Tzou, who was a panelist during the special session, “The Role of Wafer Foundries in Next –Gen Packaging.” Chaired by Sam Karikalan, Broadcom, the... »

ECTC 2013: 2.5D and 3D IC Technology Preview

ECTC 2013: 2.5D and 3D IC Technology Preview

One thing is for sure, from special sessions to the standard technology tracks, there is no shortage of 3D-focused events at ECTC 2013, which takes place at the Cosmopolitan, in Las Vegas NV, May 28-31, 2013. For starters, this year’s program takes on some remaining key issues for 2.5D and 3D IC manufacturing with two special sessions scheduled for Tuesday, May 28, 2013. From 10am-12pm, join Bro... »

Improving Communication Across Supply Chains Makes the Impossible Possible

Improving Communication Across Supply Chains Makes the Impossible Possible

Semiconductor supply chain, ecosystem, value chain: whatever you call it, its become a hot topic of discussion, and one that is near and dear to my heart as a supporter of 3D IC commercialization. Well over a year (maybe even going on two) we’ve been hearing suggested changes like a collaborative ecosystem, co-design and development, and a system level approach will help speed up time-to-market ... »

image courtesy of Future Fab International

2.5D Products and 3DIC Standards and Roadmaps Are On the Move

Naysayers be damned! Full commercialization for 3D ICs in smartphones may be a few years out, but that doesn’t dampen the spirits of the truly devoted, who latch on to every forward step as a monumental accomplishment. This week, progress appears to be taking off for 2.5D products, and the roadmaps and standards area are making notable progress. (If you can get excited about that, than you are a... »

For Discussion: Is Wright’s Law a better Economic Index for 3D ICs than Moore’s Law?

For Discussion: Is Wright’s Law a better Economic Index for 3D ICs than Moore’s Law?

I just came across a slightly mind-blowing snippet in Forbes Magazine about a study conducted by MIT and Santa Fe Institute comparing the effectiveness of different forecasting methodologies for predicting how rapidly technology will advance. The study concluded that the two most accurate methodologies are the well-known Moore’s Law and lesser-known Wright’s Law. As we all know, the form... »

3D Talk at IMAPS DPC 2013

3D Talk at IMAPS DPC 2013

At this year’s IMAPS International Device Packaging Conference, despite a robust line-up of speakers and presentations focused on 2.5D and 3D integration technologies, I came away feeling slightly empty handed. Concerned that this was just my own perspective after years of 3D IC total immersion, I asked around to take the pulse of the other attendees, many of whom are 3D IC ‘regulars’ like m... »

BiTS Workshop 2013

Interconnectologists and Market Analysts See Eye to Eye on The Changing IC Industry at BiTS Workshop

Every year in early March, I spend a day at the BiTS Workshop (Burn-in Test Strategies), not because it’s a hotbed of 3D technology information (although this year there were some papers addressing 3D test as solutions are now becoming available) but because I’ve been working with the General Chair, Fred Taber, for years, first during my tenure at Advanced Packaging Magazine, and then at Chip... »

2013 Predictions for 3D ICs as reported by SPN

2013 Predictions for 3D ICs as reported by SPN

While most of the semiconductor trade publications wrapped up their 2013 prediction posts by mid January, Semiconductor Packaging News (SPN) forged on with its original annual Viewpoints series right up until last week. I spent some time pouring over the musings of industry executives’ contributions. Many discuss the proliferation of mobile devices driving technology requirements and 3D ICs as ... »

3D IC Blogosphere Update – Feb 22

Has it really been a month since the European 3D TSV Summit? This inaugural event certainly caused a buzz in the blogosphere! In addition to all my coverage after having attended the event, Phil Garrou has been slogging his way thorough the proceedings to provide an in-depth review on Insights from the Leading Edge. I think he’s up to Part 3. Additionally, iMicronews offered “a closer look” ... »

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