Value Chain

Executive Viewpoint:  The Impact of Process Control on FOWLP and 3D IC

Executive Viewpoint: The Impact of Process Control on FOWLP and 3D IC

As Si interposer and 3D stacked memory devices enter into production, albeit in low volumes, semiconductor manufacturers are lining up their ducks to be ready for high volume manufacturing (HVM) when it happens. As a result, some suppliers of high volume manufacturing equipment who have been rather quiet through the development phase are now showing their cards. For example, KLA-Tencor recently in... »

Executive Viewpoint: Executing a 3D Supply Chain eSilicon Style

Executive Viewpoint: Executing a 3D Supply Chain eSilicon Style

While the traditional foundry/OSAT supply chain has worked for fabless semiconductor manufactures engaging in the manufacture, package, and test of 2D architectures, it’s well understood that a 3D supply chain requires something different. 3D architectures bring new issues to the table such as yield management, sourcing from different suppliers, who tests what, who owns what, how do you make s... »

Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action

Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action

It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined up next to each other in the exhibit hall, but then again maybe it was just Interconnectology in action. News linking Tezzaron/Novati with both Ziptronix and Invensas indicates progress for all three companies in the 3D IC space, and leaves open the question of how lo... »

How will the 450mm Transition Affect Advanced Packaging and 3D ICs?

How will the 450mm Transition Affect Advanced Packaging and 3D ICs?

That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual SEMICON West Thursday wrap-up discussion. It’s never been planned that way, but I always seem to interview Ranjan at the tail-end of SEMICON West, and subsequently end up bouncing a weeks accumulation of thoughts off of him. What inspired t... »

Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community

Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community

First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization of 3D ICs gets pushed out further, will it be Silicon Photonics that drives 3D ICs to volume manufacturing? That was the opinion expressed by Michael Liehr, executive VP of Executive VP CNSE, during the SEMICON West 2013 R&D Panel – “A Conversation on the Future of Semiconductor Techn... »

It Takes an Ecosystem to Launch 2.5D and 3D Integration

It Takes an Ecosystem to Launch 2.5D and 3D Integration

As 2.5D and 3D IC technologies round the ten-year development mark and volume manufacturing keeps getting pushed just beyond our reach, I’m always looking for a new angle to cover while waiting for ‘The Big One’. As usual, SEMICON West provided the opportunity not only to listen to what invited speakers and panelists have to say on the topic, but also bounce thoughts off many 3D IC technolog... »

Semi Trade Pubs Talk 3D, Just in time for SEMICON West

Semi Trade Pubs Talk 3D, Just in time for SEMICON West

That Jan Vardaman, she’s so clever! I just finished reading her column on ECTC 2013 in Printed Circuit Design and Fab, and thought her quippy, Las Vegas-y references in the opening paragraph were right on the money. Vardaman’s take on ECTC was similar to my own, discussed here in my review of the foundry panel session.  She also offers some great take-aways from some of the sessions that I m... »

2.5D Interposer wafer - TSMC

3D Buzz from ConFab, 3D Integration at IITC 2013, and more

So SPIL’s offering a turnkey model for 2.5D interposers, including fine-pitch fabrication of the interposer wafers themselves? This is certainly an interesting turn of events, particularly with TSMC’s recent announcement that they’re not married to the turnkey model and are willing to collaborate with OSATS. SST’s Phil Garrou got the scoop this week from SPIL’s Mike Ma, at the Confab. Re... »

Managing 3D IC Supply Chain Complexity and Cost:  A Conversation with WWK – Part 2

Managing 3D IC Supply Chain Complexity and Cost: A Conversation with WWK – Part 2

“The time has come when we have to understand that we can only compete WHEN we collaborate.” (Sudipto Roy, SMIC, at ECTC 2013, May 2013.) In part 1 of this article, we covered some of the challenges dealing with the business of complex 3D IC supply chains in a conversation with Alan Levine, Director, Wright Williams & Kelly, Inc. Now, in Part 2, we want to look more at putting into practic... »

Managing 3D IC Supply Chain Complexity and Cost:  A Conversation with WWK

Managing 3D IC Supply Chain Complexity and Cost: A Conversation with WWK

“Challenges that need addressing in 2.5D / 3D IC are supply-chain related. The current cost structure for 2.5D / 3D is leveraged by materials and processing equipment.” (Overheard at the GSA Silicon Summit 2013, April 2013.) Supply chain complexity and cost: it seems to be the theme common to current discussions about implementing 3D IC technology in high-volume manufacturing today. Consider t... »

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