Materials

Alchimer’s Technology Breakthrough Brings Tomorrow’s Solutions to Today’s Applications

Alchimer’s latest technology breakthrough is an interesting twist on the way semiconductor solutions generally presents themselves. We’re used to hearing about scaling that goes from bigger to smaller. This is the first time I’ve heard of a technology that scales UP to meet application needs. But that’s precisely the differentiation between Alchimer’s flagship suite of wet deposition pro... »

C2W Bonding Approaches: Variations on Theme

As chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields and the ability to stack dies of different sizes — especially in memory/logic stacks — a number of approaches have been or are being developed by various collaboratives.  At IMAPS Device Packaging, held March 8-10, 2011 in Scottsdale AZ, two approaches were presente... »

EV Group: Progress on Advanced C2W Bonding

When it comes to 3D chip stacking, chip-to-wafer (C2W) processes have proven to be the way to go for stacking known-good-die (KGD) for best yields, or if the dies being stacked are of different size. Unfortunately, sequential C2W processes have historically been time consuming, achieving low throughput; making it a costly approach. Several approaches are under development to address this; all »

Alchimer in Asia: Things are Cooking

I caught up with Alchimer CEO, Steve Lerner last week at the IWLPC in Santa Clara, to find out how things have progressed since news of Panasonic Investment Partners’ equity investment in the company back in July. It turns out setting up shop in Asia has been a great strategic move for the start-up. Last week’s announcement of the Alchimer’s licensing agreement with Nagase ChemteX unit of To... »

Progress is Progress in the Medical Device World

This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when it came to technology advancements themselves, I noticed that not much exciting has happened since last year. Or maybe I’ve just been spoiled.  Not every year can be about earth-shattering technological breakthroughs. This was the year about continuing progress of the breakthro... »

Extending Legacy Technologies into the 3D Space

While TSVs technologies make their way out of R&D on to the manufacturing floor, improvements and developments in non-TSV 3D packaging approaches continue to make waves in the industry. It only stands to reason that for companies already involved in high-volume manufacturing either as a supplier, packaging foundry, or licensor of legacy technology, that improvements affecting existing 3D pack... »

New Realities for TSV Processing

In this article, published in the May/June 2010 issue of Chip Scale Review Magazine, Steve Lerner, CEO, Alchimer, proposes a "variation on theme" for TSV cost-of-ownership. 3D integration and More-than-Moore are popular topics in the semiconductor industry, with »

Alchimer creates launch pad for industrialization

Launching a disruptive technology into an industry that is set in their ways is not a job for sissies. But Alchimer’s CEO, Steve Lerner, is clearly a man of action. »

Suppliers offer solutions to TSV formation challenges

As part of the 3D tracks at both this year’s International Wafer Level Packaging Conference, held October 27-30 in Santa Clara, CA; and the 2009 IMAPS International Symposium, held Nov 3-5 in San Jose, CA, several suppliers offered up solutions addressing current limitations in via etch, insulation/barrier/seed layers, and fill process steps for 3D TSVs. »

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