Europe in 3D

Triple I Prevails at EV Group

Triple I Prevails at EV Group

Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets. In visits I’ve made to EVG’s Schaerding, Austria world headquarters over the years, it’s clear that this Triple I approach is working for the company, which has experienced consistent growth. While I was sufficiently ... »

Automatic Wafer Metrology: Applying X-ray Technology in the 3D Space

Automatic Wafer Metrology: Applying X-ray Technology in the 3D Space

The way I see it, it was only a matter of time before Nordson DAGE brought its X-ray technology into the 2.5D and 3D IC space. The company has long been the leader for X-ray inspection in the electronics market and is now positioned to address the growing need for wafer metrology and defect review in features such as through silicon vias (TSVs). According to John Tingay, Technical Director Nordson... »

Europe in 3D: The EV Group Story Continues…

Europe in 3D: The EV Group Story Continues…

Rarely do I have the opportunity to visit a company two times and find something new to write about, never mind three. But as always, EV Group didn’t disappoint for my visit Friday (January 17, 2014) to see the company’s latest additions, both to the physical plant and to the product and technology line for 3D integration technologies.  My visit really started the evening before with a lovel... »

Europe in 3D: The Brains behind e-BRAINS

Europe in 3D: The Brains behind e-BRAINS

After so many years covering 3D technologies, I love finding a new angle to write about. Yesterday’s visit to Fraunhofer EMFT in Munich provided just that. Instead of focusing on 3D IC processes, we talked about 3D systems integration and the e-BRAINS project. And rather than discussing the well-worn topic of mobile applications, we talked about other markets that stand to benefit from 3D hetero... »

Europe in 3D

Europe in 3D: Nordson DAGE Sets Out to Measure the Invisible

What better place for the Queen of 3D to start out her Europe in 3D tour than a late lunch at the Crown Inn, in Colchester, Essex UK? I arrived in London on Monday afternoon, January 12, and was greeted by 3D InCites’ own Nick Richardson, business development manager (and unofficial court jester). We climbed aboard the chariot (aka Citroen Picasso) and headed to Colchester, UK to get our bearing... »

Europe in 3D: The 2014 Winter Tour

Europe in 3D: The 2014 Winter Tour

This winter, I’ve been invited to moderate panels at two 3D industry events. The first will be at the European TSV Summit, which takes place January 22-23, 2014 in Grenoble, and the second is during the DATE 2014 3D Integration Workshop, March 28, 2014 as part of DATE 2014, which takes place this year in Dresden. It got me thinking, what better time to visit European companies working on 2.5D an... »

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