Europe in 3D

Oerlikon Systems: Pragmatic and Poised for  3D IC High Volume Manufacturing

Oerlikon Systems: Pragmatic and Poised for 3D IC High Volume Manufacturing

In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state into one of the most highly industrialized countries in the world. But some how it has managed to keep its Alpine charm. That’s why at first glance, the city of Balzers, complete with its hilltop castle, did not strike me as a place to find a major manufacturer of high tech semiconductor equipmen... »

3D Test

Cascade Microtech: In the imec 3D Test Lab

My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of the 3D test lab to see the CM300 in action, so we suited up for Class 1000 cleanroom and stepped inside. Generally we would have had to prep for class 100 or higher for the test environment, but thanks to nifty new FOUPs that have a class 1 microenvironment to protect the wafers, we at least... »

Cascade Microtech Breaks Through the Barriers of 3D Test

Cascade Microtech Breaks Through the Barriers of 3D Test

For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has been at the top of many industry experts’ laundry list of ‘what’s-holding-up-commercialization for 3D’. First, there are technology issues: fine-pitch probing, pin count, contact force and the phenomenon of weak I/O drivers. But bigger than that, the cost of 3D test is a maj... »

3D Integration Workshop Faces Reliability Challenges Head On

3D Integration Workshop Faces Reliability Challenges Head On

The Friday 3D Integration Workshop at DATE 2014 once again found me among friends, as an intimate group of about 30 gathered to spend a day sharing knowledge gained since last year’s workshop. My key take-away for the day was how to achieve reliability and robustness. Jürgen Wolf, director of the Fraunhofer IZM-ASSID 3D integration program stepped in as keynote speaker to replace Yole Développ... »

Calling for A Collaborative Semiconductor Supply Chain Comes at DATE 2014

Calling for A Collaborative Semiconductor Supply Chain Comes at DATE 2014

Design and Test Europe 2014 (DATE 2014), which took place in Dresden, March 24-28 2014, brought together semiconductor design and test engineers from all over Europe and around the world for the purpose of understanding the latest trends, methodologies, and technologies being developed to address the ever-changing needs of chip design and test for the semiconductor and microelectronics industry. ... »

Copyright: Nino Halm (Photographer)

The Fraunhofer Cluster for 3D Integration Looks at the Big Picture

Two years ago, I visited to Fraunhofer IZM-ASSID, located in Dresden, Germany; to see first-hand what this particular arm of Fraunhofer Gesellschaft was all about. Juergen Wolf, head of IZM-ASSID, gave me the grand tour of the 300mm cleanroom and explained the organization’s focus on developing Cu TSV technologies in 300mm wafers for both 2.5D interposer and 3D IC applications. For the past ... »

Silicon Saxony: Leading the Charge in More than Moore

Silicon Saxony: Leading the Charge in More than Moore

Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development in Europe. And since the reunification, Dresden has focused its investments on a single area: high technology and affiliated research. Both GLOBALFOUNDRIES and Infineon have a significant presence here, as well as many divisions of the Fraunhofer-Gese... »

Fogale Nanotech: Building The Swiss Army Knife of 3D IC Metrology and Inspection

Fogale Nanotech: Building The Swiss Army Knife of 3D IC Metrology and Inspection

In the world of 3D ICs, where features are becoming finer and submicron accuracy and precision is more important than ever to maintain intra-wafer uniformity throughout the wafer or die stacking process flow, process control by means of metrology and inspection is more important than ever. The industry offers a number of non-destructive options – optical, X-ray, scanning acoustic microscopy – ... »

3D Architectures

Nimes, France: Influencing 3D Architectures for 2000 Years

I first visited Nimes, France when I was sixteen, on one of those whirlwind, ten-day, school-organized trips with my French 2 class. What I remembered most about it was the Roman architecture. We spent less than 24 hours there on the way to Avignon. At the time, I would never have guessed that several decades later, I would be back to pay a visit to the world headquarters of Fogale Nanotech, manuf... »

Fraunhofer EMFT: 25 years of 3D Integration in Munich

Fraunhofer EMFT: 25 years of 3D Integration in Munich

Wouldn’t it be great to get a text notification that you are almost out of toilet paper at home rather than when it’s well… almost too late? Or how about an intra-nasal sensor that detects the level of acetone in your breath to tell you if you’re accumulating or burning fat? (It kind of makes my new FitBit wearable activity monitor seem archaic already.) But this is the beginning of the I... »

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