Applications

IMEC Tech Forum Looks at Smartphones Today and in the Future

In this brave new world powered by consumer electronic devices that cater to the user experience, smartphones and tablets are in the driver’s seat; pushing researchers to the very limits of possibility. At imec’s technology form on Smartphones, held for the first time during SEMICON West, researchers from the institute and guest experts shared vision and progress with invited attendees. In hi... »

Thermocompression Bonding for Microbump Flip Chip Soldering

An excerpt from  the Semiconductor Assembly Blog by Andy C. Mackie, Global Product Manager for Indium Corporation's Semiconductor and Advanced Assembly Materials. For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D joining, is the adoption of thermocompression (TC) bonding for flip-chip flux/microbump sold... »

3D: You’ve Come a Long Way Baby!

This column by Francoise von Trapp appeared in the Jan/Feb 2011 issue of Chip Scale Review It sums up a lot of what was said at various 3D IC events over the past few months. A year ago, there were still skeptics in the room at the annual 3D Architectures for Semiconductor Integration and Packaging conference, sponsored by RTI’s Tech Venture Forum. This year, not a single hand went up when Phi... »

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