3D Event Coverage

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

To the best of my recollection (and a quick search through 3D InCites’ archives) the panel level packaging (PLP) hoopla first hit the conference circuit in 2015 at the International Wafer Level Packaging Conference (IWLPC), when Jan Vardaman made it the topic of a panel discussion, and told a cautionary tale of following PLP down the rabbit hole. It seems that ever since, PLP has been an event h... »

Sir Walter Raleigh towered above the 50th IMAPS Symposium

Sir Walter Raleigh towered above the 50th IMAPS Symposium

Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In 1587 he initiated the founding of Raleigh. Last week he welcomed – appropriately dressed – about one thousand semiconductor experts to the 50th International Symposium on Microelectronics at the Raleigh, NC, Convention Center (Figure 1). If you look closer at thi... »

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

There’s no doubt about it. Imaging sensor technologies have come a long way since the introduction of the digital camera. In fact, according to Gartner, image-based sensors will be the single largest category of devices for the internet of things (IoT) sensing (figure 1). That fact was made imminently clear a few weeks ago at the European Imaging and Sensors Summit, which took place September 21... »

Spotlight on the European MEMS and Sensors Technology Showcase

Spotlight on the European MEMS and Sensors Technology Showcase

As it’s difficult to be in two places at one time, I was happy to see that the organizers of the co-located European MEMS and Sensors Summit/Imaging and Sensors Summits made sure two featured tracks —the MEMS and Sensors Technology Showcase and The Imaging Sensors Start-up Pitches — did not run in parallel. As a result, I attended both. This post focuses on the MEMS and Sensors Technolog... »

The Brighter Side of SEMICON West 2017

The Brighter Side of SEMICON West 2017

Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own coverage. But there it was in my inbox in a recent edition of Semiconductor Packaging News: “Five Takeaways from Semicon” by Semi Engineering’s Mark LePedus. I couldn’t resist. I had to click. I must admit, Mark is more of a hardcore technology journalist than I am,... »

2017 3D InCites Awards Ceremony and Reception: A Retrospective

2017 3D InCites Awards Ceremony and Reception: A Retrospective

Once again this year, the industry came out in full force to honor excellence in heterogeneous integration at the 2017 3D InCites Awards Ceremony and Cocktail Reception to benefit KidSizeCures for childhood cancer. After a brief ceremony during which we presented 11 awards in 10 categories (find out who won here), guests enjoyed good food, drinks, and conversation, as well as some fun activities, ... »

Impressions from ECTC 2017

Impressions from ECTC 2017

Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC 2017, so tossed my stuff in my room and headed on in (wearing jeans, no less!) You can read about that here. Afterward, I had a bite to eat with industry colleagues. Back in my room at 11:15 to call it a night, only to find it raining ON my bed thanks to a leak... »

FOPLP

Fifty Shades of Fan-out Discussed at ECTC 2017

The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took place in Orlando at the Walt Disney World Swan and Dolphin Resort. The buzz started during the Tuesday evening plenary session, where panelists Douglas Yu, TSMC, Tim Olson, Deca Technologies; Steffen Kroehnert, NANIUM; Rolf Aschenbrenner... »

Meet Us at ECTC 2017 in Walt Disney World

Meet Us at ECTC 2017 in Walt Disney World

As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of leading-edge products. This will be reflected at the 67th Annual Electronic Components and Technology Conference (ECTC), which takes place May 30, June 2, 2017, at the Walt Disney World Swan & Dolph... »

Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA

Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA

The keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very important, but a relatively small part of the entire conference. After the two keynotes on Tuesday morning, I listened to YOLE’s presentation, delivered by Santosh Kumar, and learned that the three big memory vendors (Samsung, Micron, and Hynix) jointly hold over 200 TSV patents ... »

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