3D Event Coverage

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits

Tips for Navigating the European MEMS and Sensors/Imaging and Sensors Summits

For the second consecutive year, SEMI Europe is co-locating its MEMS and Sensors/Imaging and Sensors Summits in Grenoble, France, in the heart of the Rhone-Alpes. Rather than Minatec Campus, where the event was held last year, both summits will take place at The World Trade Center Grenoble. After last year’s successful and information-packed event, I’m looking forward to attending this year’... »

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased to see that this year’s Electronics Components and Technologies Conference (ECTC 2018), which takes place May 29-June 1, will be all about the new technology darlings driving development in heterogeneous integration: artificial intelligence, the human-machine interface, wearables, B... »

2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education

2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education

March 7, 2018, the day of the 2018 3D InCites Awards Ceremony, dawned chillier than normal for this time of year in Fountain Hills, AZ. As they enjoyed their breakfast on the terrace outside the conference center, attendees of the 14th Annual iMAPS Device Packaging Conference (iMAPS DPC), may have noticed an artist hard at work creating an original mural that would later provide a backdrop to comm... »

Notes from SEMI’s ISS 2018, Day One

Notes from SEMI’s ISS 2018, Day One

SEMI’s Industry Strategy Symposium (ISS) has been on my conference bucket list for some time, so when I was offered a press pass to attend ISS 2018, there was no question about attending. One day in, and I’m not disappointed. The venue, the Ritz Carleton at Half Moon Bay, is spectacular – nothing like falling asleep to the sound of crashing waves on the beach below – and so far, the speake... »

3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference

3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference

Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of heterogeneous integration tech... »

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC 2017

To the best of my recollection (and a quick search through 3D InCites’ archives) the panel level packaging (PLP) hoopla first hit the conference circuit in 2015 at the International Wafer Level Packaging Conference (IWLPC), when Jan Vardaman made it the topic of a panel discussion, and told a cautionary tale of following PLP down the rabbit hole. It seems that ever since, PLP has been an event h... »

Sir Walter Raleigh towered above the 50th IMAPS Symposium

Sir Walter Raleigh towered above the 50th IMAPS Symposium

Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In 1587 he initiated the founding of Raleigh. Last week he welcomed – appropriately dressed – about one thousand semiconductor experts to the 50th International Symposium on Microelectronics at the Raleigh, NC, Convention Center (Figure 1). If you look closer at thi... »

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

There’s no doubt about it. Imaging sensor technologies have come a long way since the introduction of the digital camera. In fact, according to Gartner, image-based sensors will be the single largest category of devices for the internet of things (IoT) sensing (figure 1). That fact was made imminently clear a few weeks ago at the European Imaging and Sensors Summit, which took place September 21... »

Spotlight on the European MEMS and Sensors Technology Showcase

Spotlight on the European MEMS and Sensors Technology Showcase

As it’s difficult to be in two places at one time, I was happy to see that the organizers of the co-located European MEMS and Sensors Summit/Imaging and Sensors Summits made sure two featured tracks —the MEMS and Sensors Technology Showcase and The Imaging Sensors Start-up Pitches — did not run in parallel. As a result, I attended both. This post focuses on the MEMS and Sensors Technolog... »

The Brighter Side of SEMICON West 2017

The Brighter Side of SEMICON West 2017

Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own coverage. But there it was in my inbox in a recent edition of Semiconductor Packaging News: “Five Takeaways from Semicon” by Semi Engineering’s Mark LePedus. I couldn’t resist. I had to click. I must admit, Mark is more of a hardcore technology journalist than I am,... »

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