3D Event Coverage

SEMICON Europa and Productronica 2019 Exhibitor Showcase

SEMICON Europa and Productronica 2019 Exhibitor Showcase

The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON Europa exhibitor floor, but as the lines fade between front-end processes, advanced packaging, and board assembly, getting the whole story called for visits to the Productronica halls as well. We had some great discussions about recent mergers, col... »

Uniting the World Through Technology Innovation

Uniting the World Through Technology Innovation

What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend SEMICON Europa and Productronica simultaneously, I highly recommend you put it on your must-do list. Not only will you reach your daily step goal, but you’ll also learn about the latest in technology innovation, see how integrated the electronics supply chain has become, and get to meet with many o... »

3D VLSI Open Workshop Showcases 3D IC Supply Chain Capabilities  

3D VLSI Open Workshop Showcases 3D IC Supply Chain Capabilities  

Severine Cheramy, Director 3D Business Development, at CEA-Leti, recently brought key partners of Leti’s 3D-IC programs together at the 6th 3D VLSI Open Workshop to give an overview of their accomplishments and to demonstrate synergies between their joint efforts. The event took place in mid-October at The DoubleTree Hotel in San Jose. Leti and ST Microelectronics: Leaders in 3D VLSI Cheramy wel... »

the Exhibits at IWLPC 2019

Products on Parade in the Exhibits at IWLPC 2019

We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out the latest supplier offerings to support technology trends, and to spread the word about our new community membership opportunities on 3D InCites. But I’ll get to that part in a bit (or if your curiosity gets the better of you, scroll to the bottom.) While we didn’t get to all the exhibitors (... »

SEMICON Europa on Preview…

SEMICON Europa on Preview…

Co-located with productronica in Munich, Germany, SEMICON Europa attracts and connects industry-leading technology companies from every segment of the European microelectronics industry. Held November 12-15, this year’s events will expand attendee opportunities to exchange ideas and promote technological progress featuring the most advanced and innovative electronics manufacturing platform in ... »

The IWLPC Fan-out PLP Smack Down

The IWLPC Fan-out PLP Smack Down

At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies. Fan-out PLP  (FO PLP) has been a hot topic on the conference circui... »

MSEC 2019: MEMS and Sensors Have a Lot to offer for System Designers

MSEC 2019: MEMS and Sensors Have a Lot to offer for System Designers

At MSEC 2019 in San Diego, CA, MEMS and sensors experts gathered to exchange ideas about how to utilize the many strengths microelectromechanical systems (MEMS) and sensors to enhance the capabilities of electronic systems. Many focused on adding AI to their devices to provide higher-value solutions. »

IWLPC 2019 Brings You Advanced Packaging in an Interconnected World    

IWLPC 2019 Brings You Advanced Packaging in an Interconnected World    

Anyone who’s anyone with a hand in the evolution of wafer-level packaging will be in attendance or exhibiting at the 16th Annual International Wafer-Level Packaging Conference (IWLPC) and Tabletop Exhibition next week. 3D InCites will be there and we’re excited to engage and learn from the industry’s most respected authorities addressing all aspects of wafer-level, 3D device packagin... »

The Decade Ahead: Emerging MEMS and Sensors Technologies to Watch

The Decade Ahead: Emerging MEMS and Sensors Technologies to Watch

Most of today’s blockbuster MEMS products—from pressure sensors and resonators to accelerometers and microphones—originated from academic research, a trend that Alissa M. Fitzgerald, Founder & Managing Member, A.M. Fitzgerald & Associates, expects to continue. While many of these potentially game-changing new technologies will require many more years of intensive development and up t... »

Exhibitor Highlights at IMAPS International Symposium

Exhibitor Highlights at IMAPS International Symposium

The 52nd International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week. Key package platforms will include system-in-package (SiP), system in module (SiM). chip-package interaction (CPI), wafer level/panel Level, 2.5D/3D/flip chip/optical, as well as high reliablity/performance, and advanced process/materials. I... »

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