2017 Industry Outlook

What does 3D Integration mean for your Company in 2015?

What does 3D Integration mean for your Company in 2015?

As December rolls in and 2014 comes to a close, I find myself reflecting on the past 11 months, and the predictions industry experts made in for 2014 in their 3DInCites industry outlooks for 2014. There’s no doubt about it, 2014 has been a good year for 3D integration technologies, with multiple product announcements particularly around 3D stacked memory’s imminent ramp to production. Addi... »

Launching a Trillion Sensors on a Sea of Through Silicon Vias

Launching a Trillion Sensors on a Sea of Through Silicon Vias

To the readers of 3D InCites: Happy New Year! I hope your 2014 will be a healthy and prosperous one for you and for your families, and I hope you will continue following 3D InCites (and maybe even be contributing yourselves) as the year progresses. Now that the Internet of Things (IoT) technology meme is in the “Peak of Inflated Expectations” phase of the Gartner Hype Cycle Curve, and with the... »

READY – AIM – FIRE! Predictions for 2.5D ICs in 2014

READY – AIM – FIRE! Predictions for 2.5D ICs in 2014

Major SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so far, economics have discouraged them from starting volume production. Ho-Ming Tong, CTO, ASE, and his team realized a few years ago that vertical stacking of logic die and/or heterogeneous functions did (and still do) require major engineering efforts and significant business model changes befo... »

3D Wafer Level Packaging: Outlook for 2014

3D Wafer Level Packaging: Outlook for 2014

In 2013, SPTS equipment sales into the advanced packaging market grew by 75%.  Some of this was due to a resurgence in 3D wafer level packaging (3D WLP); the first-generation 3D that started with CMOS image sensors in the middle of the last decade. This year’s growth was predominantly due to the demand for fingerprint sensors first seen in the iPhone 5S;  next to be used in competing phones an... »

3D IC Implementation: Outlook for 2014

3D IC Implementation: Outlook for 2014

Mobile/smart devices will continue to drive innovation and volumes in the semiconductor industry in 2014. The much discussed “Internet of Things” is a vision for the next growth cycle, and while we see this vision eventually coming true, the industry is very early in the cycle. It will take a number of years for IoT to take over the growth story from mobile consumer devices. In the meantime, 3... »

3D TSV Test Approaches: Outlook for 2014

3D TSV Test Approaches: Outlook for 2014

Metrology, process control, and electrical test are key enablers for the success of the semiconductor industry. 3D integration using TSVs offers new challenges in this area that need solutions. There seems to be industry consensus that it is extremely difficult to perform a wafer-level test that ensures the complete functionality of the TSVs. There are ideas about how to perform 3D TSV test with ... »

3D IC Design: Outlook for 2014

3D IC Design: Outlook for 2014

To date we at Mentor Graphics have seen a handful of 3D IC design releases, and even more customer evaluations. However, the predominant driver seems to be a desire to understand the space in case their company elects to move into the space. In general, the perception seems to be that the costs for the current offerings are higher than expected. Moreover, many companies are still trying to determi... »

Improving Yield and Reducing Cost of 3D TSVs: Outlook for 2014

Improving Yield and Reducing Cost of 3D TSVs: Outlook for 2014

At Alchimer, we believe that as it becomes technically more difficult to shrink to further nodes, companies will turn to 3D technologies to achieve the performance requirements of next-generation computing needs. We expect that to happen at 7nm node, when 3D will be cost competitive with scaling. In 2014, we expect to see the industry begin ramping to 3D, while at the same time, work continues to ... »

3D NAND Flash: Outlook for 2014

3D NAND Flash: Outlook for 2014

What with all the commotion about 3D NAND and the accompanying cyberspace chorus, you would surely be forgiven in thinking that its appearance was close at hand. So, the outlook for 3D NAND progress in 2014 should be fairly rosy then? Well, for the 3D NAND approaches touted so far, I beg to differ. I foresee in 2014 the enthusiasm for these 3-D NAND approaches being gradually tempered by the mai... »

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