2017 Industry Outlook

Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices

Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices

More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is being driven by the consumer markets as smartphones, tablets and many handheld devices require advanced features in light and thin products. Currently, those requirements are being fulfilled by fan-in or package on package (PoP) technologies, but real 3D l... »

Process Control Gains Importance in Advanced Packaging Applications

Process Control Gains Importance in Advanced Packaging Applications

2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum continue over the next few years? I believe it will... »

Addressing Advanced Packaging Challenges in 2017 and Beyond

Addressing Advanced Packaging Challenges in 2017 and Beyond

As the two-dimensional (2D) shrinking of planar circuits (on which Gordon Moore based his famous observation) has become more difficult and expensive, the semiconductor industry has had to find other ways to continue to put more computing power and speed into less volume. At the same time, consumers are demanding greater functionality that integrates a variety of interconnected circuit types. The ... »

Outlook 2017: Advanced Packaging Technology Takes Center Stage

Outlook 2017: Advanced Packaging Technology Takes Center Stage

The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments in advanced packaging. Among these was the production of the first hybrid bonded image sensor, which enables high-performance image processing as well as on-sensor memory to provide faster extraction and processing of images. As this image sensor technology enables an entirely ... »

What the Heterogeneous Integration Technology Roadmap Will Mean for 2017

What the Heterogeneous Integration Technology Roadmap Will Mean for 2017

While it seems that the semiconductor industry has suddenly embraced heterogeneous integration as the next revolutionary innovation to further the quest for higher performance and lower-power, lower-cost devices, it has actually been developing over the past four or more years. We at Dow Electronic Materials, along with many others in the industry, have been and continue to be active participants ... »

Shifting Packaging Landscape brings Both Challenges and Growth

Shifting Packaging Landscape brings Both Challenges and Growth

2015 overall was a mixed year for the materials sector in the electronics market, with a general slowdown in PC-related segments offset by continued growth in mobile smart phones and other handheld devices despite industry growth flattening out late in 2015. In 2016, market forecasts indicate some improved growth and potential technology shifts. Looking at the 3D IC packaging market specifically, ... »

SPTS sees a Brighter 2016

SPTS sees a Brighter 2016

In contrast to some of the gloomier predictions of the analysts, we think 2016 will be a growth year for our business. In packaging, we see a number of development projects moving into production this year, and a raft of makers adding capability to catch up with the early adopters. The major example will be the growth of fan-out wafer level packaging (FOWLP). After six years of being a niche acti... »

Deca Technologies Sees Promise in FOWLP for 2016

Deca Technologies Sees Promise in FOWLP for 2016

According to TechSearch International, we can expect to see 87% CAGR for fan-out wafer-level packages (FOWLP) over the coming 3 years. This demand is driven by a combination of several factors. Primarily there is great potential for the advanced capabilities of FOWLP to provide cost-effective system-level solutions for mid- to high-pin-count components by addressing the size and performance requir... »

A Metallization Technology Whose Time Has Come

A Metallization Technology Whose Time Has Come

2015 was a year marked by through silicon via (TSV) productization for three memory applications and a push for more MEMS and sensor technologies, as connectivity goes beyond computer-to-computer to thing-to-thing. For aveni, 2015 brought a new name, and leaps forward in commercializing our wet, molecular buildup process that provides a cost-effective alternative to conventional and costly metalli... »

A Perfect Storm is Brewing for Complex Packaging in 2016

A Perfect Storm is Brewing for Complex Packaging in 2016

If I had not attended the 2015 3D ASIP conference, my outlook for 2016 would have been less upbeat for complex packaging (2.5/3D). But this conference showed that companies and their development organizations are NOT solely looking towards FinFETS and sub 20nm silicon process nodes to meet their integration, power, speed, weight, etc metrics.   We are in the perfect storm: out of control costs a... »

Page 1 of 3123