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The Evolution of Inspection and Metrology in the AI Era

By Bastian Troeger, Director Product Marketing & Sales Support; Eyal Segev, Director of Marketing As artificial intelligence continues to push the boundaries of computing, the demand for high-performance processors has led to significant advancements in semiconductor design. The industry is transitioning from monolithic dies to chiplet-based architectures, integrating high-bandwidth memory...

UN SDGs

Sustainability 101: Recommitting to the UN SDGs

Last month’s announcement that the United States “rejects and denounces the 2030 Agenda for Sustainable Development and the Sustainable Development Goals” is consistent with the current administration’s isolationist policies. They don’t want to invest any time or money in helping people in other countries, nor do they support the rights...

The Benefits of Photonic Debonding in Advanced Semiconductor and Electronics Manufacturing

The semiconductor industry is rapidly advancing, with an increasing emphasis on cutting-edge packaging techniques such as heterogeneous integration (HI), 3D heterogeneous integration (3DHI), and chiplets. These innovations necessitate efficient, cost-effective, and damage-free debonding processes to ensure high-yield manufacturing. Conventional mechanical and laser-based debonding methods often introduce challenges such as thermal...

Jensen Huang at GTC

Onshoring Advanced Packaging Update

Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting...

IFTLE 624: TSMC widens lead on Samsung, Leads in 2nm Chip Production 

TSMC widens edge over Samsung The Taipai Times recently offered the following interesting discussion concerning the TSMC versus Samsung rivalry: “As US semiconductor giant Intel Corp. has faced continuous delays developing its advanced processes, the world’s two major wafer foundries, TSMC and Samsung, have overtaken it and become the main...

IFTLE 623: TSMC Advanced Packaging Coming to the U.S.A.   

TSMC Invests Further in Arizona Taiwan Semiconductor Manufacturing Corporation (TSMC) plans to make a $100B investment in the United States that involves building five additional chip facilities there in coming years. TSMC said the expansion plans included three new chip fabrication plants, two advanced packaging facilities and a major research...

ISS Europe 2025

Innovation Without Borders: Key Takeaways from ISS Europe 2025

Semiconductors have the power to drive technological breakthroughs and fuel geopolitical tensions. As we stand on the precipice of change, the path we choose will define the industry’s future. I recently attended the Industry Strategy Symposium Europe (ISS Europe 2025) in Sopot Poland, hosted by SEMI. This experience gave me...

March Member News

March Member News: Shaping the Future of Technology

In the month of March, the semiconductor industry saw significant advancements, strategic expansions, and key industry events shaping the future of technology. New innovations in microelectronics, packaging, and automotive systems highlighted the industry’s focus on efficiency and performance. Major acquisitions reinforced the growing emphasis on secure manufacturing and connectivity, while...

Paul Werbaneth in Tokyo, 2010.

A Tribute to Paul Werbaneth: Friend and Colleague

Earlier this month, in the middle of the IMAPS Device Packaging Conference Welcome Reception, I got an upsetting text from a fellow SemiSister, Jane Evans-Ryan, founder and principal of Genuity PR, telling me that she had just learned of Paul Werbaneth’s unexpected death on February 7. 2025 at his home...

system-level netlist

Taking 3D IC Heterogeneous Integration Mainstream

By Tony Mastroianni and Todd Burkholder, Siemens DIS Over the last several years, chiplet-based heterogeneous package integration has emerged as a promising alternative to traditional monolithic package solutions; the so-called homogenous SoC design. 3D IC heterogeneous integration is a system approach, wherein what typically would be implemented as an SoC...

The Growing Importance of Advanced Packaging in Europe – Recap of ERS TechTalk

Advanced packaging has emerged as a critical enabler of next-generation applications for artificial intelligence (AI), high-performance computing, wearables, 6G communication, and defense technologies. As traditional scaling approaches face increasing limitations, Advanced packaging enables further miniaturization and improved performance through heterogeneous integration, chip stacking, and high-density interconnects. In Europe, advanced packaging...

US Joint Consortium

IFTLE 622: US Joint Consortium; Intel Rumors       

When I was first asked why I had not yet covered the “US Joint Consortium” I responded “tongue in cheek” that I would leave that for Cheech and Chong. However, with the recent announcement of 3M joining the consortium and my subsequent understanding of the involvement of my old friend,...