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ISS 2020: How to Win in Our Data-driven World

From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at the Ritz-Carlton in Half Moon Bay. Dave Anderson, President, SEMI Americas welcomed everybody and announced that SEMI will celebrate 50 years of service to the semiconductor industry at SEMICON West...

IFTLE 438: Reliability Test For 0.3mm WLCSP; Copper RDL Trace Requirements

This week we continue our look presentations from SEMICON Europa’s Advanced Packaging Conference. Intel’s Reliability Test Beth Keser’s group at Intel Germany discussed their “product-on-board” reliability test for 0.3mm WLCSPs. The existing JEDEC/IPC board-level methodology tests are fine for traditional packaging solutions for non-extreme low K dielectric (ELK) fab nodes....

Novel Multi-die Integration Concept Offers Big Benefits

The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of Engineering, presented at the latest Luncheon on January 8 a joint study with eSilicon. It compared how die-to-wafer (D2W) bonding, using Direct Bonding Interconnect (DBI) technology, compares with traditional (2.5/3D-IC)...

IFTLE 437: Packaging Trends for Artificial Intelligence

As it has in recent years, SEMICON Europa 2019  featured a dedicated Advanced Packaging Conference. In this and my next post, we will look at some of the key presentations. In Jan Vardaman’s TechSearch presentation “Packaging Trends for Artificial Intelligence (AI)” she noted that the following package types would be...

Raise A Glass to The New 3D InCites Community!

Happy New Year and welcome to the new 3D InCites community platform! We marked 2019 by celebrating our tenth anniversary, so it seems appropriate to kick off the next decade (for the world and us) with a new look and feel for our website. You all may remember the blog...

IFTLE 436: Fluxless µBumping; Latest on Stacking Technologies

The November Issue of Chip Scale Review contains some interesting advanced packaging information that is worthy of sharing in IFTLE: the cover story on fluxless µbumping by ball placement, and Yole’s look ahead at stacking technologies. Fluxless µBumping by Ball Placement CC Dong from Air Products examined fluxless micro ball...

IFTLE 435: The Heterogeneous Integration Roadmap (HIR)

Before we start this week’s blog, let me take the opportunity to wish all IFTLE readers a Merry Christmas and Happy New Year. As has been traditional for the past decade-plus, I include a 2019 photo of the granddaughters Hannah and Madeline, who, as you can see, continue to grow...