3D Integration Themes Become a Reality at IEDM 2024
The Transistor Wars are back, but they look a little different this time. I’ve been attending the IEDM conference off and on for 30ish years. If you are in the semiconductor process side of the world, this is one of the better conferences to attend to get up to speed...
Interconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009,...
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs). The new platform relies on TSMC’s CoWoS and other advanced packaging technologies. It will allow designers to build system-in-packages (SiPs) of 3D-stacked logic,...
December Member News: Celebrating Progress and Achievements
Despite being the holiday season for much of the world, many of our members have made remarkable progress and celebrated many achievements in December. From groundbreaking technological advancements and well-deserved industry awards to strategic collaborations and significant company developments, our members are continuing to lead the way in their fields....
IFTLE 615: TSMC Evolves CoWoS Technology Promising 9x Reticle Size by 2027
TSMC recently announced at its Open Innovation Platform (OIP) Ecosystem Forum in Europe that its chip-0n-wafer-on=substrate (CoWoS) packaging technology will achieve certification by 2027, introducing a version with 9x reticle size. This will allow twelve HBM4 memory stacks, providing unprecedented performance enhancements for artificial intelligence (AI) and high-performance computing (HPC)...
Unpacking AI’s Power-Hungry Demands
With artificial intelligence (AI) spearheading many of the innovations in the microelectronics industry, Mike Ranjram, assistant professor at Arizona State University, shared his insights on data center power delivery for the evolving AI ecosystem. Speaking to a room of advanced packaging professionals at IMAPS’s last 2024 chapter event at Saras...
The 3D InCites Podcast Backtrack – 2024 in Review
Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It provides the podcast backtrack – a recap of your stats, including the top performing episodes. So we thought we’d share it with you, our listeners and sponsors, to give you...
It’s Time to Put AI’s Growth Into Perspective
These days, it seems like artificial intelligence (AI) is taking over the world. In the last two years alone, we’ve seen the rise of ChatGPT, autonomous vehicles, Google Gemini, deep fakes, and my least favorite – soulless AI art. With so many new applications coming into focus, it can feel...
IFTLE 614: What’s in Store for Intel’s Future? Update on NAPMP Proposers Day
Intel Reaches The Fork in the Road Digitimes had some interesting recent opinions about the future of Intel. Let’s take a look. With Intel struggling to make its foundry business profitable, Digitimes questions whether Intel should consider abandoning its IDM model and separate its product design and manufacturing divisions. The...
Sustainability 101: How Green is Your Electricity?
Where does the energy come from to power your facilities? Even if your company claims to be 100% renewable energy, you might be surprised to learn that much of your power comes from natural gas or even coal. Keep reading to understand this paradox. Renewable Energy Certificates Just as there...
Semiconductor Industry Forecast: Looking Forward to Balanced Growth in 2025
As the semiconductor industry moves into the last month of 2024, industry pundits are looking back and then looking forward to seeing what they missed in 2024 and preparing their assumptions for 2025. This post looks at what they are predicting to bring you the 3D InCites Semiconductor Industry Forecast....
The Role of Chiplets in Redefining Semiconductor Design
Chiplets are transforming the semiconductor landscape. Rather than relying on larger, all-in-one designs, chiplets offer a modular approach to chip manufacturing. By breaking down complex systems into smaller, reusable components, they address growing challenges in performance, scaling, and time-to-market. As Moore’s Law slows and the limits of monolithic systems on...
Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024...
November 3D InCites Member News: Advancements and Milestones
This month has been full of exciting advancements and milestones for our members. From cutting-edge technological breakthroughs and prestigious award recognitions to innovative partnerships, impactful collaborations, and significant company developments, our members continue to make remarkable strides in their fields. Here’s a closer look at the highlights and achievements they’ve...
IFTLE 613: Solder Joint Reliability of Glass Core Substrate Assemblies
We have seen considerable global activity focused on developing glass core substrate assemblies and interposers, yet, as some of us have often mentioned, we have seen little in the way of reliability data for any modules built from these substrates. IFTLE considers the work of Absolics (the US division of...
IFTLE 612: Congratulations to the IMAPS 2024 Society Award Winners
Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of the winners who attended the the gala event at IMAPS Symposium 2024. They are, from left to right: Brandon Hamilton, BAE Systems; Casey Kraweic, StratEdge; Gary Hemphill, Retired; Phil Garrou,...
SEMICON Japan 2024 Member Preview
With SEMICON Europa not too far behind us, the industry is already gearing up again for SEMICON Japan. Taking place from December 11-13, this year’s Japan event will feature interactive sessions that we haven’t seen before, including Yoichi Ochiai’s Passion Lab and SEMICON Stadium, where participants will get to engage...
Nuclear is Out. How Do We Solve the High Tech Sustainability Problem?
The past 2 weeks have been a whirlwind of activity in high tech sustainability. We’ve moved from using nuclear power for data centers to only some nuclear power for data centers. A change of administration where support for renewables and sustainability will not be as strong as under the previous...
IFTLE 611: Amkor Clarifies Arizona Facility Activity
Wolfspeed & Hemlock Semiconductor Get Their CHIPS Act Share Arizona Facility to Focus on High Performance Computing In IFTLE 577 we reported that Amkor had announced plans to build an advanced packaging and test facility in Peoria, Arizona. In IFTLE 603 we reported that Amkor Technology had signed a preliminary...
Making Connections at SEMICON Europa 2024
Let’s be honest. When we get home from a trade show like SEMICON Europa 2024, it’s not all the presentations that we remember. It’s the connections we’ve made – new and old – with industry colleagues around the globe that stand out. You can go to any SEMICON Event around...
