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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively
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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively

Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s a network storage device, network data switch, complex industrial equipment controller, or a critical core module of a defense system. And they are not getting any smaller or slower as silicon process nodes shrink and memory dema... »

IFTLE 433: AMD Chiplets go Commercial Amidst a Need for Chiplet Standardization
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IFTLE 433: AMD Chiplets go Commercial Amidst a Need for Chiplet Standardization

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Talking about Neural Networks and SoC Design Challenges
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Talking about Neural Networks and SoC Design Challenges

Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry experts, Anand Joshi and Tom Dillinger, addressed today’s hot topics —neural networks and System-on-Chip (SoC) design challenges — with short, but very informative presentations. Can We Build Neural Networks That Solve AI Chipset Power... »

Vehicle Autonomy & Electrification Push Advanced Packaging for Automotive Applications
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Vehicle Autonomy & Electrification Push Advanced Packaging for Automotive Applications

“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole). Two automotive megatrends, autonomy and electrification are today pushing the development of multiple devices with dedicated packaging. Without doubts, the automotive ... »

SUSS MicroTec and BRIDG Join Forces to Establish a Production-Level Applications Center in North America

SUSS MicroTec and BRIDG Join Forces to Establish a Production-Level Applications Center in North America

SUSS MicroTec, leading supplier of equipment and process solutions for the semiconductor industry, announced today a far-reaching collaboration agreement with BRIDG, a not-for-profit, public-private partnership focused on production process technologies, advanced system integration, and 200mm microelectronics fabrication advancing next-generation nanoscale technology. This partnership puts an unpr... »

Lam Research Offers New Capabilities in its Edge Yield Product Portfolio

Lam Research Offers New Capabilities in its Edge Yield Product Portfolio

Lam Research Corp. (Nasdaq: LRCX) is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield at the edge of the wafer, which is essential to delivering greater productivity for customers. During the semiconductor production process, device manufacturers want to build integrated circuits on the entire surface of the wafer. On the edge of the wa... »

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