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IFTLE 457: Hybrid Bonding Comes of Age

I first started covering Ziptronix and its hybrid bonding technology back in 2007 when I was writing Perspectives from the Leading Edge (PFTLE) for Semiconductor International (SI). I’d give you the references, but SI went belly up in 2010 and I learned my first lesson about the NON-archival nature of...

IFTLE 456: SPIL Fan-out Embedded Bridge (FOEB) Technology

in this week’s post, we continue our look at the 2020 IEEE ECTC virtual conference. Siliconware’s presentation “Scalable Chiplet Package Using Fan-out Embedded Bridge (FOEB)” focused on the advantages of its FOEB package for the server, high-performance computing, router, and switcher markets.  The difference between today’s 2.5D and FOEB is...

Cruising the Virtual SEMICON West Expo Hall

This morning at Virtual SEMICON West, I tried to attend a bunch of sessions and take notes so I could write about them. I really did. But I was experiencing information overload. And so, I decided to just listen to and watch a few, and maybe go back to the...

How we Helped a Customer Deliver a GEM-compliant Equipment using CCF

Welcome to the first posting in the Cimetrix CIMControlFramework (CCF) Services blog series! While Cimetrix has been providing professional services for many years, in order to better serve the growing demand from many new equipment maker customers worldwide that have purchased our CCF product, Cimetrix earlier this year formed a...

Virtual DAC 2020 Addresses Chiplets and Advanced Packaging

Why is attending Design Automation Conference (DAC 2020) important for 3D InCites readers? Two of my previous employers – National Semiconductor and VLSI Technology – could not keep up with market requirements. Lack of competitive electronic design automation (EDA) tools limited their engineers’ productivity and eventually both of these –...

Carrier Wafers for Semiconductor and MEMS Manufacturing

As technology rapidly moves forward, the reduction of device and chip size is playing an important role in implementing as many chips and sensors in the smallest space. For this reason, the thickness reduction of semiconductor wafers is necessary. Thin semiconductor wafers (thickness around 50-100 µm) are flexible and fragile....

IFTLE 455: Advanced Microelectronics is Coming Home

In IFTLE 441, (published in February before we were paying attention to the pandemic and the devastation to the world economy that it has brought) we discussed the desire of the US Government to have on-shore, state-of-the-art (SOTA) microelectronics sources. Recently amid pressure from the US, TSMC announced preliminary plans to...

SEMICON China – An Exhibitor Perspective

After the cancellation of SEMICON Korea in January, not many were surprised to learn that SEMICON China would not take place in March as planned. After a couple of months in limbo, SEMI finally announced that the big exhibition would be moved to the end of June, during a weekend,...

Zooming Into SEMICON West

This year, 3D InCites is zooming into SEMICON West, talking with our community to see how our members are handling this challenging landscape and to share updates on technology, business, and other news. Join us in the 3D InCites virtual booth to view Zoom interviews with ASE Group, Cimetrix, EV...

SEMICON China 2020 at a Glance

SEMICON China 2020, collocated with FPD China, was successfully held June 27-29, 2020. SEMICON China was the first big semiconductor industry show held in Shanghai this year since most of the exhibitions were canceled due to COVID-19. And it may be the only SEMICON event we’ll see with physical booths...