Jun 05, 2023 · By Phil Garrou · Blogs
Let’s begin looking at some of the presentations from the 2023 IMAPS Device Packaging Conference in March. Showa Denko becomes Resonac My old friend, Hidenori Abe, detailed the formation of Resonac through the combination of Showa Denko and Showa Denko Materials (formerly Hitachi Chemical (Figure 1), He also shared some...Jun 01, 2023 · By Trine Pierik · From Different Dimensions
SEMI and TechSearch International announced that the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, in their new Global Semiconductor Packaging Materials Outlook report. High-performance applications, 5G, artificial intelligence...May 31, 2023 · By DECA · Blogs
The CHIPS and Science Act aims to bring semiconductor research & development and manufacturing back to U.S. soil. Not only will this make the U.S. less reliant on the international supply chain, but it is estimated that this investment in onshore semiconductor and research facilities will create over half a...May 30, 2023 · By Keith Felton · 3D In-Depth
If you are designing a heterogeneously integrated, multi-die, high-performance device for markets such as HPC, AI, data centers, etc., then the silicon interposer is probably the platform of choice. Yes, it comes at a cost, and generally requires expensive silicon place-and-route (P&R) tools, along with workflows for implementation. With the...May 24, 2023 · By Julia Goldstein · Blogs
The idea of semiconductor manufacturing becoming a trillion-dollar industry is astounding, exciting, or worrisome, depending on your viewpoint. Growth in the sector will provide jobs and create products that will make life better for millions of people. But the more chips we make, the higher the environmental impact of their...May 23, 2023 · By Trine Pierik · 3D Event Coverage
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference (ECTC) in Orlando. I have counted 24 companies with booths, and even more presenting papers. It’s going to be the best three days in packaging, components, and microelectronic systems science,...May 22, 2023 · By Stephen Hiebert · 3D In-Depth
Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence (AI), servers, and data centers. As the technology matures, further growth is projected into consumer applications, memory devices including high bandwidth memory (HBM), and mobile and automotive applications that could...May 17, 2023 · By Dean Freeman · 3D In Context
There is no shortage of topics for someone writing about sustainability in May. April went from having Earth Day to being earth month, with sustainability press releases on nearly a daily basis. A significant number of companies use April and May as their release dates for company responsibility reports with...May 16, 2023 · By Phil Garrou · Blogs
TSMC and the CHIPS & Science Act I think it would be fair to say that most of us thought that TSMC would be getting their share of the CHIPS Act monies (Creating Helpful Incentives to Produce Semiconductors) to offset the costs of building its US fab/fabs in Arizona. However,...May 15, 2023 · By Francoise von Trapp · Blogs
The semiconductor and microelectronics industries are in the midst of a workforce crisis created by, among other things, the combination of explosive growth and a maturing workforce. Competition for STEM talent in other industries has made it difficult to recruit the latest generation of graduates, who are lured by seemingly...May 10, 2023 · By Phil Garrou · Blogs
While most of us in advanced packaging is familiar with CEA-Leti, CEA-List ( Laboratoire d’Intégration de Systèmes et des technologies) is one of three specialized technological research institutes of CEA specializing in digital systems. Denis Dutoit, of CEA-List, presentation on “Chiplet Partitioning Can Balance Among Performance, Flexibility and Scalability” at...May 09, 2023 · By Dean Freeman · 3D In Context
The photo of my May calendar was a picture of a 1956 RAMAC computer with a whopping five megabytes of storage. The note on my calendar states that it could hold the entire phone book of Manhattan. The photo made me think of recent technology announcements, the announcements yet to...May 08, 2023 · By John Park · Blogs
The semiconductor industry’s decades-long adherence to Moore’s Law doctrine of doubling transistor counts on monolithic devices every 18 – 24 months has been amazingly successful. It’s now possible to integrate tens of billions of transistors onto a monolithic die whose area may be hundreds of square millimeters. The resulting chips...May 04, 2023 · By Phil Garrou · Blogs
IFTLE has been updating our readers on the chiplet market and the technology since I served as subject matter expert (SME) for DARPA’s Dan Green who gets credit for developing the CHIPS program (Common Heterogeneous Integration and IP Reuse Strategies) in 2017. At that time the average packaging engineer couldn’t...May 03, 2023 · By Emerald Greig · Blogs
I attended my first SEMI Foundation-organized Women in Semiconductors (WIS) event on May 1st. It was held in conjunction with the Advanced Semiconductor Manufacturing Conference (ASMC) in Saratoga Springs, NY. I really didn’t know what to expect but I know I wasn’t expecting standing-room-only with 200 people attending. The other...May 02, 2023 · By Francoise von Trapp · Blogs
For the first time in 3D InCites’ history, I was invited to attend a TSMC Technology Symposium, which took place April 26 at the Santa Clara Convention Center. You might be asking, why was this my first time? Great question! I always assumed it was because Herb Reiter, our EDA...May 02, 2023 · By Solin Ahmad · 3D In-Depth
With the increasing expectations and demands of customers of electronic equipment, the manufacturing technologies applied are also propelled due to rising requirements. Powerful wearables, the Internet of Things (IoT), mobile communication devices, and new huge data storage subsystems push the semiconductor industry and the electronics designers to new heights, and...Apr 27, 2023 · By Trine Pierik · From Different Dimensions
Cadence, ASE Group, and Chung Yuan Christian University (CYCU) announced collaboration on an education and training program to cultivate talent for 3D-IC Design. Cadence collaborates with universities on system packaging education and talent development through the Cadence Academic Network program, which provides students with access to Cadence advanced IC packaging...Apr 27, 2023 · By Francoise von Trapp · Blogs
14 years ago, I had an idea to create a content platform devoted to the advancement of semiconductor 3D Integration technologies. I called it 3D InCites because to “incite” means to “stir up interest in”. I also liked the play on 3D IC. I started attending industry events and blogging...Apr 24, 2023 · By Mike Kelly · 3D In-Depth
Heterogeneous IC packaging is here. It is already in production, and increasingly more customers are developing and qualifying their products at Amkor and in other outsourced semiconductor assembly and test (OSAT) suppliers and foundry providers. The rationale for this surge into new multi-die embodiments has been well documented and discussed....
