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Building a Dense 3D-IC System: Power Challenges

Recently, there has been a very healthy discussion on whether Moore’s law is still valid. While the arguments fly from both sides, there is one thing that everyone agrees on – chiplets are the solution to the need to constantly increase the functionality of SoC, while also reducing cost. Whether...

3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview

The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with a focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial,...

Chiplet Designs and Heterogeneous Integration Packaging

System-on-Chip (SoC) integrates ICs (by reducing the feature size) with different functions such as central processing unit (CPU ), graphic processing unit (GPU ), memory, etc. into a single chip for the system or subsystem. Unfortunately, it is more and more difficult and costly to reduce the feature size (to...

Employee Engagement is Key to ESG Success

TSMC has a significant challenge on its hands when the topic of Environmental Social Governance (ESG) comes up. They are growing at a rapid rate, as the chip industry continues to grow. They are currently the technology leader from a minimum pitch, and use of advanced technology such as EUV,...

IFTLE 534: A Look at DARPA’s Next Generation Microelectronics Manufacturing (NGMM) Program

DARPA often selects its research efforts through the Broad Agency Announcement (BAA) process. The Microsystems Technology Office (MTO) at DARPA is currently seeking proposals “…to inform planning for the Next Generation Microelectronics Manufacturing (NGMM) program”. NGMM in a subsequent solicitation will attempt to establish a domestic center for producing silicon...

Are You Listening? 3D InCites Summer Podcast Wrap Up

Are you listening to the 3D InCites podcast yet? We had a busy summer! Our listenership grew, and we achieved a significant milestone of over 5500 downloads since we first began our podcast journey just over a year ago. Not only that but we were excited to see we’re reaching...

Workforce Development Considerations in the Megachips Era

A recent Wall Street Journal article, The Microchip Era Is Giving Way to the Megachip Age, explains how the chip industry is transitioning from monolithically integrated chips to stacking chiplets to make megachips. In the U.S., DARPA is embarking on the Next Generation Microelectronic Manufacturing initiative focused on three-dimensional heterogeneous...

Chiplets and Sustainability

Advances in packaging can improve yield and reduce cost. Can they also reduce the environmental footprint of an electronic device? Let’s consider one example, the chiplet. Instead of large-monolithic CPUs with multiple functions integrated into one piece of silicon, the functions are divided between multiple smaller chiplets mounted on an...

ESTC 2022 Member Company Preview

Chaired by 3D InCites Community member Steffen Kröhnert of ESPAT Consulting, the Electronics System-Integration Technology Conferences (ESTC) series is a premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. This year, the event is being held in Sibiu,...

Artist rendering shows the entryway of TSMC's campus in North Phoenix

IFTLE 531: CHIPS and Science Act; TSMC Phoenix; Details on Apple M1

CHIPS and Science Act The CHIPS and Science Act will provide $54.2B in funding for the semiconductor and wireless industry, including $52 billion in grants and incentives specifically for the American semiconductor industry. In addition, a 25% investment tax credit for the manufacture of semiconductors and tools to create semiconductors...

R&D and Smart Technology Leading the Way in China

Despite China reacting to the United States CHIPS and Science Act, the country continues to move forward with R&D and smart technology projects launched in August, continuing to be focused on R&D and new energy. The 10GW photovoltaic n-type cell production project based in the Economic and Technological Development Zone...