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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively
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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively

Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s a network storage device, network data switch, complex industrial equipment controller, or a critical core module of a defense system. And they are not getting any smaller or slower as silicon process nodes shrink and memory dema... »

SEMI ASMC 2019: Heterogeneous Integration Enters the Mix
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SEMI ASMC 2019: Heterogeneous Integration Enters the Mix

“It’s relatively easy to build a fancy new transistor in the lab, but in order to replace what we’re doing today, you need to be able to put billions on a chip, at a reasonable cost, with high reliability and almost no defects. It is very difficult. That makes it all the more important to pursue other ways of making better computers.” Linley Gwennap, in The Economist, March 2016. “It may... »

Fan-out Panel-level Packaging Comes to the ECTC Technology Corner
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Fan-out Panel-level Packaging Comes to the ECTC Technology Corner

On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became clear by the number of exhibitors displaying their product samples, that one of my blogs would be an update on fan-out panel-level packaging. For the past few years, fan-out panel-level packaging (FOPLP) has been in hot debate: is it needed? Does it REALL... »

Advanced Substrates: The Winds of Change
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Advanced Substrates: The Winds of Change

Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation. However, in the past few years, things have changed. The dedicated landscape welcomed innovative solutions and new players. “Today, we are facing an increasingly competitive ecosystem and players are looking to differentiate from each other’s” asserts Ma... »

IFTLE 416: What’s Coming Next on the IC Front End? Samsung Gates All Around
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IFTLE 416: What’s Coming Next on the IC Front End? Samsung Gates All Around

IFTLE has been saying for a few years that the decades-long scenario of moving from one node to the next was, for most if not all, dead and, that we had to keep our eyes open for what the next IC technology would be, because as we all know packaging only exists to protect and assist chips function. Based on the 2019 Samsung Foundry Forum, which took place this May in Santa Clara, we certainly need... »

The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors
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The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors

Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth, I talked to people I’ve known for decades and others I was meeting for the first time. By visiting booths and listening to presentations, I gained insight into how the semiconductor packaging industry has evolved in the past decade and why work I did ten or 25 years ago is newly relevant. E... »

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