Blog Page Example

sustainable materials development

Sustainability 101: Rethinking Sustainable Materials

The materials we use to make products are usually chosen with performance as the highest priority, followed by cost. Performance encompasses both as-manufactured parameters and long-term reliability. While these metrics are crucial, they are not the only concern. Increasingly, environmental impact plays a more significant role in materials development and...

ECTC 2024 3D InCites Community Member Preview

2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of our community member companies presenting, exhibiting, and in some cases both, this may be our most well-represented year yet! ECTC 2024 is packed with program sessions, interactive presentations, and special...

IFTLE 592: DIBC Hosts Advanced PCBs and Electronic Substrates Industry Day

In early April the Defense Industrial Base Consortium (DIBC) held an “Industry Day for Advanced Printed Circuit Boards (PCBs) and Electronic Substrates” at the IPC APEX Expo. Let’s look at the “Advanced Printed Circuit Boards and Substrates Industry Day” presentation by Korine Duval, Ph.D., Microelectronics Sector Lead for the Innovation...

Hybrid Bonding: The Time has Come

The growing demand for semiconductors, from the cloud to the edge, from artificial intelligence (AI) to 5G communications, has exceeded the capabilities of traditional silicon scaling. In the “More than Moore” era, performance requirements for leading-edge semiconductor devices demand extremely fine pitch (<10µm, or even <1µm) interconnection in semiconductor packaging...

April Member News: Earth Day, Partnerships, Notable Achievements

As the semiconductor industry continues to experience a surge of innovation, companies worldwide are collaborating to propel technology forward while also addressing sustainability issues and investing in STEM education. From pioneering product debuts and events to strategic alliances and efforts in workforce development, our members had lots of news to...

Bridging the path from university to industry

Bridging the Path from University to Industry

The university setting offers a valuable environment for future engineers to explore and learn about technologies that will become part of their daily lives when transitioning from school to a career. At the same time, universities working on microelectronics and advanced R&D are increasingly looking for more advanced manufacturing equipment...

Thermal Simulation of a Packaged GaN MMIC

StratEdge has been designing and manufacturing packages for high-power, high-frequency compound semiconductors since the early 1990s, with much attention focused on gallium arsenide (GaAs) and gallium nitride (GaN). Because of its ability to operate at very high currents and high voltages, gallium nitride GaN is widely used in applications for...

SCC

SEMI Kicks off Year Three of the SCC and Startups for Sustainability

It is popular for mainstream media to publicize different industry’s energy consumption and environmental habits. The semiconductor industry is not immune to this occasional finger-pointing concerning energy consumption, water consumption, and hazardous chemicals that are used to produce the chips that are ubiquitous in our daily lives. Major publications highlight...

NHanced Semiconductors Odon Facility Grand Opening

IFTLE 590: The NHanced Semiconductors Roadmap

If you have been following the announcements from Bob Patti and his company, NHanced Semiconductors, it would not be surprising if you were a bit confused about how all these announcements will be coming together. I know IFTLE was, so we approached longtime friend Bob Patti and came up with...

Solving the AI Puzzle

An AI package is like a puzzle made up of individual pieces of different sizes and shapes, each one essential to the final product. Together, these pieces are typically integrated into a 2.5D IC package designed to reduce footprint and maximize bandwidth. A graphic processing unit (GPU) and multiple 3D...