Blog Page Example

ESD Bags

Sustainablity 101: Build a Better ESD Bag

When I worked for Advanced Packaging magazine in the early 2000s, we sometimes got pitches from companies that made cardboard boxes or foam cushioning materials. Their spokespeople obviously had not read the magazine or looked beyond the word “packaging” in the title. We ignored those pitches. However, many levels of...

Intel Foundry

Will the Intel Foundry Model Succeed?

The foundry world has been big news in the past few weeks. TSMC started up the Kumamoto Fab,  Japan’s leading-edge semiconductor technology center, partnering with Tenstorrent on RISC-V and chiplets to be manufactured at Rapidus. The biggest non-surprise news flash was the roll-out of Intel’s Foundry Direct Connect, which they...

IMAPS DPC

IMAPS DPC 2024 Community Member Preview

IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual  Device Packaging  Conference (DPC), is scheduled from March 18 to 21 in Fountain Hills, AZ. Simultaneously, the Workshop on Advanced Packaging for Medical Microelectronics will take place at the WeKoPa Resort...

IFTLE 586: US CHIPS Act Monies Begin to Flow

US Chip Fabrication, Packaging & Assembly Industry In August 2023, one year after the U.S. CHIPs Act was signed into law, the White House announced that over 460 companies had already submitted statements of interest to receive funding. GlobalFoundries The U.S. Dept of Commerce has announced $1.5B in direct funding...

SEMICON China 2024

SEMICON China 2024 Community Member Preview

SEMICON China 2024 takes place March 20-22 at the Shanghai New International Expo Centre. This year’s event is expected to draw the attention of the global semiconductor supply chain as the country continues considerable capacity expansion to increase its share of global semiconductor capacity. According to the SEMI Year-End Total Semiconductor...

February member highlights

February Member Highlights – Acquisitions, Awards, Events, New Offerings and More

The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product introductions, events, job openings, and more. Here’s a collection of February member highlights. Acquisitions, Partnerships and Collaborations ASE announced a strategic partnership with Infineon Technologies, to acquire two back-end manufacturing...

IFTLE 585: Lincoln Labs Chiplet Technology for ELAICs

The February issue of Chip Scale Review contained an interesting article entitled “Heterogeneous Chiplet Integration to Make Megachips” authored by members of the advanced technology division of MIT’s Lincoln Labs. The work had previously been shown at the 2023 IEEE ECTC. While I don’t see anything revolutionary about their technology...

the ERS workforce enjoying an annual party.

Fueling the Workforce Through Investment and Engagement

It is an exciting time to be an equipment manufacturer in the European semiconductor industry. There is still a lot of buzz around the EU Chips Act and companies like Intel, TSMC, and GlobalFoundries & STMicroelectronics have announced huge investments in Europe over the next few years. However, Europe is...

Rapid Development and Optimization of Thermal Management Solutions for Advanced Semiconductor Packaging

As the power density increases for semiconductor devices, thermal management is becoming an ever more critical challenge for reliability and performance, for high-performance computing, AI, data center, power electronics, and other applications. Heat dissipation is often a great concern as the junction temperature rises with an increased power density, which...

Semiconductor Device Test

The Year in Semiconductor Device Test

Is semiconductor device test non-value added? Certainly, some aspects are unchanging. Test is one of the three means to guarantee parts in addition to characterization and the design itself. Given the market backdrop – across automotive, computing, and advanced packaging – new test challenges and value adds have emerged. Three...

IFTLE 583: DoD funding for U.S. Based Substrate Manufacturing

IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA) were invented by U.S. companies like Motorola, production capacity was all off-shored to Asia years ago. Having competent U.S. production capacity has always been part of the US reshoring program....

Fostering Innovation from Within

As many organizations in the industry are grappling for external resources, Onto Innovation has expertly chosen to look inward. We recognize the unmatched talent that exists at our company already and have implemented a course of action that directly taps into that. Our employees continuously push the boundaries of innovation,...

Announcing the Winners of the 2024 3D InCites Awards

It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to improve the program. We intended to provide more opportunities for participation across the heterogeneous integration supply chain, and we are happy with the outcome. A special thank you to the...

January Member Achievements, New Hires and Grand Openings

Members of the 3D InCites community hit the year running by celebrating milestones, new hires, promotions, and grand openings. Here are some highlights that caught our attention. Amkor Technology, Inc. hosted DesignCon2024 at the Santa Clara Convention Center in Santa Clara, CA Among the speakers was Amkor’s Ruben Fuentes, VP...