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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively
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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively

Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s a network storage device, network data switch, complex industrial equipment controller, or a critical core module of a defense system. And they are not getting any smaller or slower as silicon process nodes shrink and memory dema... »

Could ON Semiconductor be GlobalFoundries’ White Knight?

Could ON Semiconductor be GlobalFoundries’ White Knight?

In light of recent rumors, could ON Semiconductor’s acquisition of GlobalFoundries’ East Fishkill fab save the company from being carved up further? The Basics Phoenix, AZ-based ON Semiconductor (ON Semi) announced its second big acquisition in the past month: the purchase of GlobalFoundries’ (GF) East Fishkill 300mm semiconductor fab. The first was the acquisition of WiFi technology... »

Advanced Heterogeneous Packaging Solutions for High Performance Computing
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Advanced Heterogeneous Packaging Solutions for High Performance Computing

Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad, running the gamut from artificial intelligence (AI), deep learning, data center networking, supercomputers, and autonomous driving. In fact, a new generation of deep learning AI, leading central processing units (CPUs) for data center servers as wel... »

Update on  3D X-ray and DBI Technology for Advanced and 3D Packaging
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Update on 3D X-ray and DBI Technology for Advanced and 3D Packaging

The Microelectronics Packaging & Test Engineering Council (MEPTEC) held its monthly meeting at SEMI in Milpitas on April 10.  Two speakers outlined their companies’ capabilities and demonstrated their own expertise in solving specific industry challenges. Tom Gregorich presented why and how Zeiss supports IC package inspection with 3D X-ray machines, then Sitaram Arkalgud conveyed the benef... »

IFTLE 410: ST Microelectronics Bets on SiC; A Look at Power Device Packaging
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IFTLE 410: ST Microelectronics Bets on SiC; A Look at Power Device Packaging

Silicon Carbide (SiC) is a wide bandgap (WBG) material that has advantages when compared to silicon (Figure 1).  For the same die size and thickness, WBG devices provide higher breakdown voltage, current, operating temperature, and switching speed; and lower switching loss over Si devices.  ST Microelectronics (ST Micro) started working with SiC in 1996, producing its first SiC diodes in 2004. I... »

Reliable Process Control Solutions for the Growing Power Device Market
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Reliable Process Control Solutions for the Growing Power Device Market

The expected increase of the power device market, with a compound annual growth rate (CAGR) of more than 10% — and more particularly insulated-gate bipolar transistor (IGBT) products for automotive and other applications — is pushing the semiconductor industry to adopt specific process solutions. The maturity of IGBT market, boosted by booming demand for electrified vehicles (EV) and hybrid el... »

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