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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively
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Optimizing Your SoCs and ASICs to Design PCBs More Cost Effectively

Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s a network storage device, network data switch, complex industrial equipment controller, or a critical core module of a defense system. And they are not getting any smaller or slower as silicon process nodes shrink and memory dema... »

Courtesy of The GSA Twitter feed.
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The Need For and Value of Semiconductor Industry Organizations

Recognizing the need for and value of semiconductor industry organizations, in 1994, Jodi Shelton and CEOs of fabless IC companies founded  the Fabless Semiconductor Association (FSA). The traditional integrated device maker (IDM) business model was declining and the need for close cooperation between IC designers at fabless IC companies (Broadcom, Nvidia, Qualcomm, etc.) and more cost-effective ... »

Trymax Receives Order from a Leading-Edge Photonics Research Organization

Trymax Receives Order from a Leading-Edge Photonics Research Organization

NIJMEGEN, THE NETHERLANDS- Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received an order from NanoLab@TU/e of Eindhoven University of Technology. The NEO 200A series from Trymax with microwave downstream plasma technology was selected to perform resist stripping, descum, and surface cleaning on indium phosphide (InP) wafers. This order il... »

MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm

MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series line of die bonders. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 µm at 3 sigma, to ±1.5 µm at 3 sigma. Moving forward for shipment starting from October 1, 2019, the product names will be MRSI-H and MRSI-HVM (formerly kno... »

IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing
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IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing

A year after GLOBALFOUNDRIES cancels its 7nm program, the company is developing 3D chip stacks fabricated using GLOBALFOUNDRIES’s 12nm FinFET process and features ARM’s mesh interconnect technology in 3D. This alternative to costly node shrinking may help GLOBALFOUNDRIES maintain a market presence. »

How to Transform Innovative Technologies Into Customer-Specific Solutions
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How to Transform Innovative Technologies Into Customer-Specific Solutions

Technology innovations don’t reach customers right away. It takes careful collaboration with the right partners to transform a new and innovative technology into high-value, customer-specific solutions. »

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