Alan Huffman

Alan Huffman is currently the Business Unit Director for Heterogeneous Integration at SkyWater Technologies where he is responsible for business development, and customer engagement. Over the course of his career, his focus has been on the development and implementation of advanced interconnect technologies, including wafer-level packaging, flip chip, and micro-bump interconnect, 2.5D and 3D integration, and characterization and process development for electronic materials used in these technologies. He has authored or co-authored numerous papers and presentations on a number of advanced packaging topics, particularly on high-density interconnect technologies and the characterization of polymer material processes. He was awarded an RTI President’s Award in 2012 for his contributions to the 3D microsystems program and received 6 Highly Published Author awards during his tenure with RTI International.