ASE Group

Despite the lack of physical events, ASE's team was hard at work in 2020 evangelizing the importance of heterogeneous integration, spreading the message that heterogeneous integration through participating and speaking at many virtual events throughout the year. The company is committed to collaborative efforts across the supply chain to further these efforts, most recently partnering with Siemens Siemens Digital Industries Software to generate two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation. The new high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance – a program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs. ASE is invested in both chip-level (SoC) package integration and system-level integration. Its portfolio of Si-level integration technology solutions range from low- to high-density chiplet integration including flip-chip multi-chip-module (FC-MCM), fanout chip-on-substrate.