YES vacuum cure technology supports today’s most advanced MEMS and semiconductor process applications. Whether for complete curing of polyimide in WLP/RDL applications or annealing copper in an advanced semiconductor device, YES’s vacuum cure systems achieve total environmental control to increase yields and extend device performance. Compared to the traditional atmospheric cure, YES’s vacuum cure process offers complete outgassing with no trapped solvents, excellent electrical and thermal performance, superior resistance to warping at high temperatures, particle elimination, temperature uniformity, shorter process time, reduction in nitrogen usage and fast ROI. As dielectric materials have evolved to meet the challenges of WLP and emerging FOWLP applications, the need for a perfect cure has become mission-critical. Consequently, YES’s vacuum cure has become the technology of choice for Fortune 100 companies implementing FOWLP.