Heterogeneous integration using system-in-package (SiP) approaches is now recognized as the way forward to enable technologies like artificial intelligence, 5G, edge and cloud computing, electric vehicles (EVs) and advanced driver assist systems (ADAS), wearables and more. All of these require different types of SiP, ranging in density, functionality, and cost. It also requires a spirit of collaboration across the supply chain to achieve. Not only does ASE offer a broad spectrum of SiP solutions, but the company takes an active role as an ecosystem partner to support innovation. In fan-out technologies, ASE offers chip-first eWLB, chip-first M-Series, and also higher cost chip-last. It has demonstrated 2µm l/s on 300mm round panels, and are working on ]even finer features to create a higher productivity interposer replacement.