Brewer Science has been instrumental in developing materials and processes enabling advancements in temporary carrier technology. This has enabled the creation novel fan-out wafer-level (FO-WLP) packaging requirements targeting 20-µm pitch interconnect for chip-to-chip placement. To achieve this density and to further scale it down, a critical element is ultra-precise die-to-die positioning in the micron range. Advances in temporary bonding materials and carrier systems are required to enable such applications. Recently developed materials have shown that it is possible to transfer ultrathin reconstituted substrates (thickness below 100 µm) between two carrier substrates with minimal to zero die shift.