Fraunhofer EMFT

2018 Edition. In Research Institute of the Year

Demonstration of high-performance communication:
Fraunhofer EMFT developed a novel specific fine-pitch 3D-TSV technology for RF IC and RF MEMS applications in cooperation with EPFL and IMEC.
Demonstration of Low-Temperature 3D Integration Processes for Advanced Sensor Systems:
Fraunhofer EMFT demonstrated advanced 3D detector/IC systems: read-out-circuit dies connected by Solid-Liquid Interdiffusion (SLID) to sensor wafer in cooperation with Max-Planck-Institute for Physics.