Water-soluble fluxes have served as the typical industry standard for advanced packaging assembly for years. However, as the trend toward miniaturization continues to increase at a rapid rate, water-soluble fluxes pose significant challenges. Due to the required cleaning processes and tight spacing, flux becomes trapped or impossible to be cleaned away effectively.
Indium Corporation’s ground-breaking Ultra-Low Residue No-Clean Fluxes enables 2.5D advanced packaging manufacturers to eliminate the cleaning process, thus protecting the integrity of the solder joint which may experience excessive pressure/stress during cleaning.
Indium Corporation’s Ultra-Low Residue No-Clean Fluxes have a proven track record of solving numerous assembly challenges, such as preventing delamination caused by water-soluble flux residue leftover after cleaning, eliminating the cost of cleaners, and shortening the processing time.