Accomplishment
Introduction of a supply chain focused program whose goal is to jump-start the OEM/design industries ability to adopt the latest IC Packaging technologies. By creating an open, no cost program, the World's OSATs can now get access to state of the art design tools, technical expertise and expert support to help them define and build design flow, Assembly Design Kits and Process Design Kits that will be made public their customers. This OSAT Alliance program and its members outputs will help IC design companies and their designers explore the latest Packaging technologies with the lowest risk possible.
