Professor Rao Tummala is a Distinguished and an Endowed Chair Professor in Electrical and Computer Engineering and in Materials Science and Engineering at Georgia Tech. He was the Director of IBM ’s Advanced Packaging Research laboratory responsible for IBM ’s Strategy and Programs in the U.S. , Europe and Japan before accepting a research center directorship at the Georgia Institute of Technology in 1993. Prior to joining Georgia Tech, Prof. Tummala was a Fellow at IBM Corporation where he invented a number of major technologies for IBM's products. During the last 10 years, Rao pionnered the System on Package (SOP) and vertical integration on glass substrate.