2017 Edition. In Engineer of the Year
Ivor Barber, Corporate VP, Packaging, AMD, has enjoyed a distinguished career in engineering and engineering management, with a focus on semiconductor packaging. He has been a Senior / Staff Package Design Engineer with LSI Corporation, the Manager/Director Flip Chip Package Design and Characterization, also at LSI, and the Senior Director Package Technology Development at XILINX, in addition to other positions. Ivor is a clear and entertaining speaker who is able to convey the essence of engineering challenges in packaging to audiences of all levels, based on his extensive experience in the industry and his good sense of humor.