2017 Edition. In

GLOBALFOUNDRIES' advanced packaging and test solutions provide a direct path to power, performance, cost and form-factor optimized solutions. Capabilities include:
Novel wafer-level fan-out solutions (HD-FO)
Non-monolithic integrated solutions (2.5/3D)◦2.5D silicon interposers
High bandwidth memory / Advanced memory integration with stacked memories
Integrated on interposer, parallel interface
Hybrid memory cube (standalone memory, serial interface)

◦3D TSV at advanced nodes