2017 Edition. In
NANIUM S.A. is a world-class provider of semiconductor assembly, packaging, test, engineering and manufacturing services. The company started as Siemens Semiconductors back in 1996 and nowadays is a leader in 300mm Wafer-Level Packaging , both Fan-In/WLCSP and Fan-Out/WLFO. NANIUM offers in-house capabilities for the entire development chain, from design to multiple Wafer-Level Packaging technologies, and the flexibility to tailor and test solutions that respond to the most demanding customer requirements. In recognition of NANIUM's market-leading role in fan-out, Amkor Technology announced in early 2017 that it will acquire NANIUM to enhance Amkor’s position as one of the leading providers of WLP and WLFO packaging solutions.