Fraunhofer Cluster for 3D Integration

The Fraunhofer Cluster for 3D Integration is represented by the Fraunhofer IZM-ASSID, Fraunhofer ENAS, Fraunhofer IIS/EAS, Fraunhofer IKTS, Fraunhofer IPMS

… for their fundamental work in 3D Heterogeneous Integration for the realization of Smart System in Package in the era of Internet of Things (IoT). Each institute in the cluster delivers a holistic approach to the design, development, and implementation of 3D heterogeneous systems for industrial applications from demonstrator development up to prototyping and low-volume manufacturing

The Fraunhofer 3D Cluster looks at the system from all perspectives from functionality, design, technology, performance and reliability and provide an integrated solution as a system integrator. The complete value chain is available inside the cluster to serve the customer for a successful 3D solution. The cluster is also involved in various projects supported by the European commission e.g. MASTER 3D, CarrICool, ADMONT – each institute bringing its very own expertise into the project and in this way generating valuable synergies to create and validate new technical and technological solutions.