Boyd Rodgers led the development M-Series and its unique Adaptive Patterning technology, which addresses the die-shift issue in conventional fan-out wafer level packaging. He is a three-time winner recipient IWLPC Best Paper Awards including Best of Wafer-Level Packaging Track for his paper, “Implementation of a Fully Molded Fan-Out Packaging Technology” as well as overall Best Paper and Best of the WLP Track designations for his paper titled “Enhancing WLCSP Reliability Through Build-Up Structure Improvements and New Solder Alloys.”