Archives Nominees Archive - 3D InCites

Nomination #14140

Nomination #14140

Nomination Nominated: Seth Molenhour, Brewer Science Category: Engineer of the Year Significated Accomplishment: Seth Molenhour has been instrumental in developing numerous industrial solutions within our wafer-level packaging business unit, in addition to implementing continuous improvement processes as an Associate Applications Engineer with Brewer Science. Molenhour not only works hand in hand ... »

Nomination #14138

Nomination #14138

Nomination Nominated: Brewer Science Category: Materials Supplier of the Year Significated Accomplishment: Brewer Science (BSI) has been supplying advanced materials to the semiconductor market for over 37 years. For the last 13 years, BSI has been supplying temporary bonding/debonding materials that cover a wide variety of release methods, including chemical, thermal slide, mechanical, and laser ... »

Nomination #14136

Nomination #14136

Nomination Nominated: Brewer Science RDL First – Fan Out Category: Process of the Year Significated Accomplishment: Brewer Science has developed a laser release material that can help meet all of the critical requirements for sacrificial materials in the RDL-first process. This material is not only for adhesion and release, but can also serve as a foundational material upon which all the oth... »

Nomination #14134

Nomination #14134

Nomination Nominated: OmniVision Technologies’ OS05A20 Image Sensor with Nyxel™ Technology Category: Device of the Year Significated Accomplishment: The OS05A20 is OmniVision’s first image sensor with the new Nyxel™ technology for near-infrared (NIR) sensing, which leverages novel silicon semiconductor architectures and processes to tackle the challenges plaguing NIR image sensors.... »

Nomination #14132

Nomination #14132

Nomination Nominated: OmniVision Technologies’ Nyxel™ Technology Category: Process of the Year Significated Accomplishment: OmniVision’s new Nyxel™ technology for near-infrared (NIR) image sensing leverages novel silicon semiconductor architectures and processes to tackle the challenges plaguing NIR image sensors. OmniVision’s approach to NIR imaging combines thick-silicon pi... »

Nomination #14127

Nomination #14127

Nomination Nominated: Rogue Valley Microdevices Category: Device Manufacturer of the Year Significated Accomplishment: Founded in 2003 and based in Medford, Oregon, Rogue Valley Microdevices maintains a 200mm MEMS devices foundry, supporting its customers from early R&D through pilot production. As a full-service precision MEMS foundry, the company combines state-of-the-art process modules wit... »

Nomination #14125

Nomination #14125

Nomination Nominated: AerNos Category: Device of the Year Significated Accomplishment: Through a partnership with precision MEMS foundry Rogue Valley Microdevices, AerNos offers an ultra-miniaturized, affordable gas sensor technology that can monitor air quality on an individual level. What’s was the challenge? Monitoring the air we breathe is an enormous challenge because air quality varies dra... »

Nomination #14123

Nomination #14123

Nomination Nominated: Nanomedical Diagnostics Category: Device of the Year Significated Accomplishment: Through a partnership with precision MEMS foundry Rogue Valley Microdevices, Biotech company Nanomedical Diagnostics has introduced the first mass-produced graphene biosensor available, Agile R100. What’s was the challenge? • Drug discovery today is a laborious and costly process. To evaluat... »

Nomination #13013

Nomination #13013

Nomination Nominated: Adaptive Patterning, Deca Technologies Category: Process of the Year Significant Accomplishment: Adaptive patterning for wafer level fan-out packaging permits the shift of the die following pick and pack to be accommodated during subsequent processing thereby resolving yield issues that may occur due to the placement tolerance. A comparison would be to suggest wire bonding b... »

Nomination #13012

Nomination #13012

Nomination Nominated: M-Series™, Deca Technologies  Category: Device of the Year Significant Accomplishment: Wafer level fan-out packaging has been recognized as a technology with attributes that address many of the challenges the industry faces with more conventional approaches. M-Series addresses some of the key limitations the incumbent approaches faced courtesy of the adaptive processing c... »

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