Archives Nominees Archive - 3D InCites

Nomination #15369

Nomination #15369

Nomination Nominated: ERS electronic GmbH Category: Device Manufacturer of the Year Significated Accomplishment: ERS electronic GmbH has taken the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700. The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel for... »

Nomination #15363

Nomination #15363

Nomination Nominated: HSIO Technologies-Benchmark Electronics Category: Process of the Year Significated Accomplishment: HSIO Technologies has developed an exciting new manufacturing process technology focused on Direct Die Attach Liquid Crystal Polymer dielectric material (LCP). HSIO’s manufacturing partner Benchmark Electronics is establishing volume production capability that combines Sub... »

Nomination #15347

Nomination Nominated: Mentor, a Siemens Business Category: EDA Provider of the Year Significated Accomplishment: Mentor continues to drive the proliferation of Assembly Design Kits with integration of packaging design tools like Xpedition to the Calibre platform. Name: John Ferguson Email: john_ferguson@mentor.com Phone: 503-685-0446 »

Nomination #15322

Nomination #15322

Nomination Nominated: imec Category: Process of the Year Significant Accomplishment: Imec 3D team Eric Beyne: Wafer level molding Name: Pete Molenaar Email: p.molenaar10@upcmail.nl Phone: +31651461837 »

Nomination #15318

Nomination #15318

Nomination Nominated: Rozalia Beica Category: SemiSister Award Significated Accomplishment: Too much to catch in 150 characters Name: Pete Molenaar Email: p.molenaar10@upcmail.nl Phone: 0651461837 »

Nomination #14140

Nomination #14140

Nomination Nominated: Seth Molenhour, Brewer Science Category: Engineer of the Year Significated Accomplishment: Seth Molenhour has been instrumental in developing numerous industrial solutions within our wafer-level packaging business unit, in addition to implementing continuous improvement processes as an Associate Applications Engineer with Brewer Science. Molenhour not only works hand in hand ... »

Nomination #14138

Nomination #14138

Nomination Nominated: Brewer Science Category: Materials Supplier of the Year Significated Accomplishment: Brewer Science (BSI) has been supplying advanced materials to the semiconductor market for over 37 years. For the last 13 years, BSI has been supplying temporary bonding/debonding materials that cover a wide variety of release methods, including chemical, thermal slide, mechanical, and laser ... »

Nomination #14136

Nomination #14136

Nomination Nominated: Brewer Science RDL First – Fan Out Category: Process of the Year Significated Accomplishment: Brewer Science has developed a laser release material that can help meet all of the critical requirements for sacrificial materials in the RDL-first process. This material is not only for adhesion and release, but can also serve as a foundational material upon which all the oth... »

Nomination #14134

Nomination #14134

Nomination Nominated: OmniVision Technologies’ OS05A20 Image Sensor with Nyxel™ Technology Category: Device of the Year Significated Accomplishment: The OS05A20 is OmniVision’s first image sensor with the new Nyxel™ technology for near-infrared (NIR) sensing, which leverages novel silicon semiconductor architectures and processes to tackle the challenges plaguing NIR image sensors.... »

Nomination #14132

Nomination #14132

Nomination Nominated: OmniVision Technologies’ Nyxel™ Technology Category: Process of the Year Significated Accomplishment: OmniVision’s new Nyxel™ technology for near-infrared (NIR) image sensing leverages novel silicon semiconductor architectures and processes to tackle the challenges plaguing NIR image sensors. OmniVision’s approach to NIR imaging combines thick-silicon pi... »

Page 1 of 11123»