3D In Context

About Herb Reiter

After more than 20 years in technical and business roles at semiconductor and EDA companies, Herb Reiter founded eda2asic Consulting, Inc. in 2002 to focus on increasing the cooperation between EDA suppliers and ASIC vendors. In this role Herb introduced innovative IC design tools to the major semiconductor vendors worldwide. In 2008 he expanded his scope into Multi-die ICs. As chair of the GSA’s 3D-IC Working Group (2008-2011) and as SEMATECH business development consultant (2012 + ‘13), he broadened his horizon to include interposers and 3D-ICs technology, semiconductor materials as well as manufacturing, metrology and test equipment. In 2014 + '15 Herb consulted with Si2, to encourage development and standardization of data exchange formats for Interposer and 3D-IC design flows. Since early 2016 he is consulting with the newly formed Electronic System Design Alliance (formerly EDAC), to accelerate market acceptance of Multi-die ICs, the essential building blocks for the emerging System Scaling methodology.
Herb attended 40+ Continuing Education courses at Stanford University, earned an MBA at San Jose State University and Master Degrees in Business and Electrical Engineering at the University and the Technical College in Linz/Austria, respectively. He can be reached at herb@eda2asic.com

Here are my most recent posts

The Internet of Things and Semiconductor Test

The Internet of Things and Semiconductor Test

Herb Reiter, eda2asic, presented this poster presentation titled “The Internet of Things and Semiconductor Test” at the Test Vision 2020 Workshop during Semicon West 2014. Here is the printed transcript of the talk. The accompanying slides referenced in the text can be downloaded as well. In the 1990s cell phones started to connect people wirelessly and changed the way of verbal commun... »

Courtesy of Apple and IBM

Apple and IBM on the Way to Demonstrate That ONE plus ONE is More Than TWO

Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and IBM are going to cooperate to offer enterprise solutions. See more about this significant step here and in many other headline news coming out this week. The former rivals are joining forces to combine Apple’s user-friendly hardware with IBM’s enterprise experience and s... »

Should EDA vendors, OSATS, and their customers cooperate more?

Should EDA vendors, OSATS, and their customers cooperate more?

Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent three days at the EDA-focused 51st Design Automation Conference in San Francisco. In addition to realizing that these two locations are about three thousand miles apart, I noticed that the packaging and EDA camps are still far apart in regards to share of mind ... »

Survey and Review of  2.5D and 3D IC Packaging Technologies

Survey and Review of 2.5D and 3D IC Packaging Technologies

On April 9, 2014 Herb Reiter presented a 2.5D and 3D IC packaging-centric update in context with an IEEE/CPMT dinner meeting at the Biltmore Hotel in Santa Clara. About 50 silicon-, packaging-, assembly and test experts attended this 1-hour presentation. Most of them stayed for the very interactive Q & A session, that turned out be last another hour. In his presentation, Reiter discussed ̶... »

Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?

Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?

Years ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half of my mind didn’t pay much attention to such a mushy topic…. until Dr. Dyer confused me with what sounded like a play on words. He said “When you change the way you look at things, the things you look at change!” Thanks to my digital video recorder, I was able to g... »

A Sneak Peek at IITC and AMC 2014

A Sneak Peek at IITC and AMC 2014

The recent announcement of the International Interconnect Technology Conference (IITC), combined with the Advanced Metallization Conference (AMC) in the Double Tree Hotel in San Jose, from May 20-23, caught my eye, because it also offers several sessions relevant for 3D-IC materials and manufacturing. On Tuesday, May 20, will be a day-long Workshop on “Manufacturing of Interconnect Technologies:... »

Fans of the Fork

When You Come to a Fork In the Road, Take It

When Yogi Berra made this very wise statement, he certainly didn’t mean to give specific advice what to choose. I interpret his statement as an encouragement to make an educated decision and pick the best alternative, whenever you come to a fork in the road. The semiconductor industry is facing such a fork in the road to continued success. As the attached slide from last year’s CDN Live confer... »

Breaking Down Walls between Board, Package, and IC Design Steps

Breaking Down Walls between Board, Package, and IC Design Steps

Many years ago, when I started in the semiconductor business, the circuit designers only had to worry about functionality and, after completing their job, “threw the design over the wall” to the layout team or contractor. As recently as 10 years ago, IC designers only had to worry about silicon performance and after verifying functionality and timing, they “threw the design over the wall” ... »

Book Review: Design and Modeling for 3D ICs and Interposers

Book Review: Design and Modeling for 3D ICs and Interposers

For almost 50 years the semiconductor industry has practiced continued shrinking of transistor feature sizes and has been able to pack, with every new process generation, more functionality, at lower cost, onto a single piece of silicon in one IC package. However, physical limits to shrinking and rapidly increasing cost of this methodology have triggered the development of alternatives that combin... »

READY – AIM – FIRE! Predictions for 2.5D ICs in 2014

READY – AIM – FIRE! Predictions for 2.5D ICs in 2014

Major SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so far, economics have discouraged them from starting volume production. Ho-Ming Tong, CTO, ASE, and his team realized a few years ago that vertical stacking of logic die and/or heterogeneous functions did (and still do) require major engineering efforts and significant business model changes befo... »

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