Eshylon is used by the leading semiconductor companies in the world to solve their complex, leading-edge wafer processing challenges. Eshylon's Mobile Electrostatic Carrier (MESC) platform delivers unmatched ROI for thin wafer handling, fab repurposing and wafer thinning applications through extraordinary yield, versatility, cost and throughput.
Traditionally, wafers are bonded to a handle carrier with chemical bonding agents or tapes for backside thinning. Both processes present release difficulties when the wafer it at its most valuable state. Eshylon’s MESCs are optimized for wafer thinning applications by providing flat, rigid platforms for backside wafer thinning and CMP de-stress. Once these processes are complete, the thin wafer can be easily removed in seconds. We add a final bonding surface that is slightly conformal for bonding bumped surfaces.