Based in Switzerland, DYCONEX AG is one of the world’s leading providers of miniaturised, highly complex and highly reliable solutions in the area of interconnect technology. The company has its seeds in a 1964 founded division within Oerlikon-Contraves and acts as DYCONEX since a management buy-out in 1991. As one of the true pioneers in the industry, DYCONEX has continuously applied the latest technology to derive innovative technologies for various markets.

DYCONEX provides a competitive edge for your business through its high-end interconnect expertise and is an extremely reliable and predictable partner who can deliver products and services with premium quality.

Due to long-term dedication and expertise, DYCONEX has earned a solid reputation for being a technology leader and the partner of choice for interconnect solutions custom tailored to the corresponding requirements.

  • Ultra-high-density/microvia PCBs in flex, rigid-flex and rigid multilayer technology
  • Interconnect solutions for 3D miniaturisation
  • Biocompatible substrates based on LCP
  • High-frequency designs, also using LCP
  • High-temperature designs
  • Chip packaging substrates

DYCONEX offers all the technological prerequisites needed to implement the most challenging solutions, and among them are ultra-fine structures, ultra-thin base materials, thin film technology, stacked and filled holes, biocompatible materials, embedded components, as well as the latest high performance base materials.

State-of-the-art manufacturing and inspection systems, a high level of automation plus a flexible manufacturing processes allow to produce circuit boards with the highest possible connection density.

Manufacturing processes at DYCONEX are completely integrated into a manufacturing execution system (MES). Materials and processes are 100 percent traceable. The company is ISO 9001, ISO 13485 and EN 9100 certified.