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Addressing the Challenges of Surface Preparation for Advanced Wafer Level Packaging

Addressing the Challenges of Surface Preparation for Advanced Wafer Level Packaging

The importance of surface preparation and wafer cleans during semiconductor device manufacturing is migrating from front-end wafer processing to back-end wafer level packaging processes. To get a clearer picture of how this impacts semiconductor equipment and materials suppliers, 3DInCites spoke with Anil Vijayendran, vice president of marketing at Veeco Instruments, Precision Surface Processing D... »

 Latest Abatement System Installation Marks a Milestone of Success for Edwards

 Latest Abatement System Installation Marks a Milestone of Success for Edwards

SAN FRANCISCO – SEMICON West (11 July 2018) – Edwards Vacuum, a leading manufacturer of vacuum and abatement solutions, announces a milestone of 10,000 Edwards inward fired combustion abatement systems installed worldwide. Edwards calculates that its abatement systems have prevented emissions equivalent to over 14 million tons of carbon dioxide in 2017. “The safety and efficiency of our ... »

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the installation of its flagship MRSI-M3 Die Bonder in AIM Photonics Academy’s Education and Practice Factory at the Massachusetts Institute of Technology (MIT) in Cambridge, MA, USA. This is the beginning of a grea... »