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#3D design · #3D design Tools · #EDA Tools 
An EDA Perspective on Today’s Advanced Packaging
In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of... Big Data, Speed and Security Dominate DesignCon 2020
About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January... Book Review: Handbook of 3D Integration – Volume 4
An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs.... Wally Rhines Discusses the Importance of EDA and Design at IWLPC 2018
At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at... EDPS 2017: NOT the usual Electronic DESIGN Process Symposium
When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold... 3D IC Test: Now and The Road Ahead
Solutions for 3D IC test are ready today, but they will be more ready tomorrow. At the 2015 ISTFA, I... ‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial
While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents,... Why Do We Need Assembly Design Kits for Packages?
In our last article, we talked about a project we participated in to test the feasibility of an assembly design... Mentor Graphics: Xpedition Package Integrator
Xpedition® Package Integrator provides a holistic co-design methodology that automates planning and optimization of connectivity from a chip through multiple... Can Path Finding be used in the Production Environment?
In previous posts, I have discussed various scenarios when Path Finding can be used. All were focused on the early...
An EDA Perspective on Today’s Advanced Packaging
In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of...
Big Data, Speed and Security Dominate DesignCon 2020
About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January...
Book Review: Handbook of 3D Integration – Volume 4
An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs....
Wally Rhines Discusses the Importance of EDA and Design at IWLPC 2018
At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at...
EDPS 2017: NOT the usual Electronic DESIGN Process Symposium
When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold...
3D IC Test: Now and The Road Ahead
Solutions for 3D IC test are ready today, but they will be more ready tomorrow. At the 2015 ISTFA, I...
‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial
While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents,...
Why Do We Need Assembly Design Kits for Packages?
In our last article, we talked about a project we participated in to test the feasibility of an assembly design...
Mentor Graphics: Xpedition Package Integrator
Xpedition® Package Integrator provides a holistic co-design methodology that automates planning and optimization of connectivity from a chip through multiple...
Can Path Finding be used in the Production Environment?
In previous posts, I have discussed various scenarios when Path Finding can be used. All were focused on the early...Community Members
