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ISS Europe 2021 Tackles Digital Transformation and Sustainability

While I am very dedicated to my role as a blogger for the semiconductor industry, there is one thing to which I am more dedicated: A good night’s sleep. So for the Live days of ISS Europe 2021, I only attended the panel discussions that were scheduled at 7 am...

TechSearch International Analyzes Substrate Shortages and Explores Potential Solutions

Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based chip scale packages (CSPs). Substrate suppliers are adding capacity to meet the demand for FC-BGA substrates for server, graphics processor, and networking applications, but demand continues to outstrip supply. Regardless of the package type—whether silicon...

The 5G Rollout: An Industry in Transition

As predicted, 2020 will go down as the year 5G hit the big time. But it got off to a rocky start. Back in January, the semiconductor industry—and the world as a whole—had high hopes for the 5G rollout. Then COVID-19 hit, and two things happened. First, progress on the...

Not Even the Coronavirus can Stop the 5G Rollout, or Can It?

At last month’s IMAPS Device Packaging Conference, when I was not in keynote sessions, I was spending time chatting with industry colleagues to get their take on industry drivers. In all honesty, there was less talk about technology and more about the Coronavirus, which was still just barely hitting US...

How 5G is Enabling a Connected World

It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on the success of 5G. 5G will make smart factories more efficient; bring medical care to remote places; make the autonomous vehicle infrastructure possible so you stop rear-ending the person in...

SiP Technology To Enable Technology Megatrends

Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures for Semiconductor Integration and Packaging Conference (3DASIP), originally produced by RTI Tech Venture Forum, which took place annually in December in San Francisco. The IMAPS...

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018

The cynic inside often thinks “All hat, no cattle” about the newest new, new thing (right, Michael Lewis?). But if you were to consult the Gartner Hype Cycle listings from 2008 as I just did you would find, perhaps to your surprise, that Cloud Computing, 3-D Printing, Solid-State Drives, and...

First-Mover Advantage: Fan-Out Panel Level Packaging at IWLPC 2016

“It is better to be first than it is to be better.” (Ries and Trout, in The 22 Immutable Laws of Marketing.) Or is it “Fast Followers Not First Movers Are The Real Winners?” Fan-Out Wafer Level Packaging has built up such a head of steam this year (see “iPhone...

EV Group: “Triple I” at Work

It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner in 1980 and subsequent launch of the world’s first double-sided mask aligner for the emerging MEMS market five years later; to its most recent industry-first launch of a fully-automated wafer...

2021 3D InCites Awards Winner Circle

The 2021 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies.  We expanded our scope of coverage, adding a special focus on sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI) with two special award categories. Like every other awards event in the...