Featured Member
Upcoming Events
Job Openings
Top Stories
Community Member Monthly News – September
Sustainability 101: What Makes A Sustainability Leader?
Why Men Should Attend Women-Focused Events like Women in Semiconductors
IMAPS San Diego Community Member Preview
Solving Semiconductor Greenhouse Gas Chemistry Challenges
(Almost) Everything You Need to Know about the 2024 3D InCites Awards and Yearbook
Trending Topic
#Plasma solutions · #Plasma-Therm 
Talking With Trymax About Innovative Plasma-Based Equipment
This interview with Trymax Semiconductor’s Peter Dijkstra, Chief Commercial Officer (CCO), and Karsten Arts, Process Engineer first appeared in Atomic... Community Member Monthly Highlights — November
Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new... Making Connections at SEMICON Europa 2022
What a week! From keynotes, panel discussions, and podcast interviews, to booth parties and after-hours networking – the week at... SEMICON Europa 2022 Member Preview
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving... Plasma Treatment During Fan-Out Packaging Maximizes Performance and Optimizes Costs
In recent years, there has been an increased focus on fan-out wafer-level packaging (FOWLP) due to the smaller packaging size... IFTLE 408: Plasma Dicing; Intel compares High-density Packaging for HI
Plasma Dicing Advanced packaging is bringing with it new ways to separate die from the wafer. In the past, wafer...
Talking With Trymax About Innovative Plasma-Based Equipment
This interview with Trymax Semiconductor’s Peter Dijkstra, Chief Commercial Officer (CCO), and Karsten Arts, Process Engineer first appeared in Atomic...
Community Member Monthly Highlights — November
Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new...
Making Connections at SEMICON Europa 2022
What a week! From keynotes, panel discussions, and podcast interviews, to booth parties and after-hours networking – the week at...
SEMICON Europa 2022 Member Preview
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving...
Plasma Treatment During Fan-Out Packaging Maximizes Performance and Optimizes Costs
In recent years, there has been an increased focus on fan-out wafer-level packaging (FOWLP) due to the smaller packaging size...
IFTLE 408: Plasma Dicing; Intel compares High-density Packaging for HI
Plasma Dicing Advanced packaging is bringing with it new ways to separate die from the wafer. In the past, wafer...Community Members
