Value Chain

A*STAR IME, STATS ChipPAC and Qualcomm collaborate to develop low cost interposer technology

A*STAR IME, STATS ChipPAC and Qualcomm collaborate to develop low cost interposer technology

Singapore 29 May, 2013– Singapore’s A*STAR Institute of Microelectronics (IME), Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Incorporated, and STATS ChipPAC have announced a collaboration to develop technology building blocks for Low Cost Interposers (LCI) for 2.5D ICs. “2.5D/3D IC technology provides ample opportunities to further increase functionality and perf... »

3D IC Business Model: A Customer Decision
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3D IC Business Model: A Customer Decision

After more than a year of touting the turnkey model, even TSMC is jumping on board the collaboration bandwagon for manufacturing 2.5D and 3D ICs at high volume. This revelation came this week at ECTC 2013 (May 28-31, Las Vegas) from TSMC’s Jerry Tzou, who was a panelist during the special session, “The Role of Wafer Foundries in Next –Gen Packaging.” Chaired by Sam Karikalan, Broadcom, the... »

ECTC 2013: 2.5D and 3D IC Technology Preview

ECTC 2013: 2.5D and 3D IC Technology Preview

One thing is for sure, from special sessions to the standard technology tracks, there is no shortage of 3D-focused events at ECTC 2013, which takes place at the Cosmopolitan, in Las Vegas NV, May 28-31, 2013. For starters, this year’s program takes on some remaining key issues for 2.5D and 3D IC manufacturing with two special sessions scheduled for Tuesday, May 28, 2013. From 10am-12pm, join Bro... »

Improving Communication Across Supply Chains Makes the Impossible Possible

Improving Communication Across Supply Chains Makes the Impossible Possible

Semiconductor supply chain, ecosystem, value chain: whatever you call it, its become a hot topic of discussion, and one that is near and dear to my heart as a supporter of 3D IC commercialization. Well over a year (maybe even going on two) we’ve been hearing suggested changes like a collaborative ecosystem, co-design and development, and a system level approach will help speed up time-to-market ... »

image courtesy of Future Fab International

2.5D Products and 3DIC Standards and Roadmaps Are On the Move

Naysayers be damned! Full commercialization for 3D ICs in smartphones may be a few years out, but that doesn’t dampen the spirits of the truly devoted, who latch on to every forward step as a monumental accomplishment. This week, progress appears to be taking off for 2.5D products, and the roadmaps and standards area are making notable progress. (If you can get excited about that, than you are a... »

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