Value Chain

It Takes an Ecosystem to Launch 2.5D and 3D Integration
Packaging Roadmap

It Takes an Ecosystem to Launch 2.5D and 3D Integration

As 2.5D and 3D IC technologies round the ten-year development mark and volume manufacturing keeps getting pushed just beyond our reach, I’m always looking for a new angle to cover while waiting for ‘The Big One’. As usual, SEMICON West provided the opportunity not only to listen to what invited speakers and panelists have to say on the topic, but also bounce thoughts off many 3D IC technolog... »

Semi Trade Pubs Talk 3D, Just in time for SEMICON West

Semi Trade Pubs Talk 3D, Just in time for SEMICON West

That Jan Vardaman, she’s so clever! I just finished reading her column on ECTC 2013 in Printed Circuit Design and Fab, and thought her quippy, Las Vegas-y references in the opening paragraph were right on the money. Vardaman’s take on ECTC was similar to my own, discussed here in my review of the foundry panel session.  She also offers some great take-aways from some of the sessions that I m... »

2.5D Interposer wafer - TSMC

3D Buzz from ConFab, 3D Integration at IITC 2013, and more

So SPIL’s offering a turnkey model for 2.5D interposers, including fine-pitch fabrication of the interposer wafers themselves? This is certainly an interesting turn of events, particularly with TSMC’s recent announcement that they’re not married to the turnkey model and are willing to collaborate with OSATS. SST’s Phil Garrou got the scoop this week from SPIL’s Mike Ma, at the Confab. Re... »

Managing 3D IC Supply Chain Complexity and Cost:  A Conversation with WWK – Part 2
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Managing 3D IC Supply Chain Complexity and Cost: A Conversation with WWK – Part 2

“The time has come when we have to understand that we can only compete WHEN we collaborate.” (Sudipto Roy, SMIC, at ECTC 2013, May 2013.) In part 1 of this article, we covered some of the challenges dealing with the business of complex 3D IC supply chains in a conversation with Alan Levine, Director, Wright Williams & Kelly, Inc. Now, in Part 2, we want to look more at putting into practic... »

Managing 3D IC Supply Chain Complexity and Cost:  A Conversation with WWK
DSC_9571 broken chain stacked_1200px_130327 zerosum

Managing 3D IC Supply Chain Complexity and Cost: A Conversation with WWK

“Challenges that need addressing in 2.5D / 3D IC are supply-chain related. The current cost structure for 2.5D / 3D is leveraged by materials and processing equipment.” (Overheard at the GSA Silicon Summit 2013, April 2013.) Supply chain complexity and cost: it seems to be the theme common to current discussions about implementing 3D IC technology in high-volume manufacturing today. Consider t... »

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