Value Chain

Executive Viewpoint:  The Impact of Process Control on FOWLP and 3D IC
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Executive Viewpoint: The Impact of Process Control on FOWLP and 3D IC

As Si interposer and 3D stacked memory devices enter into production, albeit in low volumes, semiconductor manufacturers are lining up their ducks to be ready for high volume manufacturing (HVM) when it happens. As a result, some suppliers of high volume manufacturing equipment who have been rather quiet through the development phase are now showing their cards. For example, KLA-Tencor recently in... »

Executive Viewpoint: Executing a 3D Supply Chain eSilicon Style

Executive Viewpoint: Executing a 3D Supply Chain eSilicon Style

While the traditional foundry/OSAT supply chain has worked for fabless semiconductor manufactures engaging in the manufacture, package, and test of 2D architectures, it’s well understood that a 3D supply chain requires something different. 3D architectures bring new issues to the table such as yield management, sourcing from different suppliers, who tests what, who owns what, how do you make s... »

Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action

Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action

It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined up next to each other in the exhibit hall, but then again maybe it was just Interconnectology in action. News linking Tezzaron/Novati with both Ziptronix and Invensas indicates progress for all three companies in the 3D IC space, and leaves open the question of how lo... »

How will the 450mm Transition Affect Advanced Packaging and 3D ICs?

How will the 450mm Transition Affect Advanced Packaging and 3D ICs?

That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual SEMICON West Thursday wrap-up discussion. It’s never been planned that way, but I always seem to interview Ranjan at the tail-end of SEMICON West, and subsequently end up bouncing a weeks accumulation of thoughts off of him. What inspired t... »

Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community

Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community

First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization of 3D ICs gets pushed out further, will it be Silicon Photonics that drives 3D ICs to volume manufacturing? That was the opinion expressed by Michael Liehr, executive VP of Executive VP CNSE, during the SEMICON West 2013 R&D Panel – “A Conversation on the Future of Semiconductor Techn... »

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