Test and Inspection

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Perspectives on 3D Integration: The Researchers

To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for technology that rivals no other; except perhaps that of Rao Tummala of Georgia Tech.  But John is definitely more vocal in his passion. Rao has a softer, gentler approach.  At this year’s IWLPC in Santa Clara, both expressed their perspectives on what they see as the most cost effective ... »

3-D chips and Evolving Test Strategies Take Center Stage at ITC

Program chair Erik Volkerink of Verigy discusses this year's International Test Conference in an interview with Rick Nelson, Chief Editor, Test and Measurment World. The testing of 3-D chips, protocol-aware test, and concurrent test will be key topics on the agenda of the 41st International Test Conference October 31 through November 5 in Austin TX. While the test of 3-D chips was a key focus at ... »

DATE’10 3D Integration Workshop addresses applications, technology, architecture, design, automation, and test’

3D Workshop organizers Erik Jan Marinissen (IMEC), Yann Guillou (ST-Ericsson) Geert Van der Plas (IMEC) report back from a very successful second year at DATE, 2010 in Dresden, Germany. »

Bringing Transparency to 3D Integrated Structures – Olympus Confocal IR Microscopy

Metrology is consistently one of the more challenging areas in the semiconductor field. Whether it’s the monitoring of ultra-small features and defects, or inspecting the backside or bevel of a wafer, the challenges are ever growing. The situation is further complicated by the need for in-line metrology that can be used in the fab during device manufacturing as distinct from out-of-line failur... »

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