Test and Inspection

FormFactor Tackles Probe Test for 3D ICs
Product Mx-Finepitch MicroProbe CEO Slessor A (2) nanopierce

FormFactor Tackles Probe Test for 3D ICs

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long time, the jury was out on the probe-ability of micro-bumped TSV wafers. The jury was also unsure whether or not there was any point to probing to ensure known good die (KGD) or will “probably good die” suffice, given the cost of test? Probe test companies, FormFactor and Microprobe wer... »

TSV Inspection
dage2 March.jpg

NORDSON: Newcomers to 3D ICs

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. As 3D ICs get closer to volume manufacturing, we’re seeing newcomers joining the 3D IC party with solutions that help along established process flows, and fill in gaps. Longtime suppliers to the mainstream advanced packaging market, NORDSON Dage and NORDSON March, have each identified areas in 3D I... »

Late Breaking SEMICON West News: Expert TechHUBs Added to this Year’s Agenda

Late Breaking SEMICON West News: Expert TechHUBs Added to this Year’s Agenda

New this year at SEMICON West, and just introduced to the program late last week, the Expert TechHUBs will help attendees find answers to specific semiconductor test and packaging questions. Meet with industry experts in an informal discussion group on the North Hall show floor at TechHUB Test or in TechHUB Assembly & Packaging. The Hubs will be held on Tuesday and Wednesday from 11:00am – 4... »

Momentum Builds for the 2013 3D InCites Awards

Momentum Builds for the 2013 3D InCites Awards

Subscribers are practically blowing up 3D InCites as they duke it out online and race the  July 3rd deadline for casting their ballots in the public opinion poll for this inaugural 3D InCites Awards; which is great because the first 3D InCites Awards Breakfast, co-presented by 3D InCites and TechSearch International, is fast approaching, and we’ve got an exciting program shaping up. We’re hap... »

2013 3D Test Workshop Call for Papers
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2013 3D Test Workshop Call for Papers

The 2013 3D-TEST Workshop focuses exclusively on test of and design-for-test for three-dimensional stacked ICs (3D-SICs), including Systems-in-Package (SiP), Package-on-Package (PoP), and especially 3D-SICs based on Through-Silicon Vias (TSVs), micro-bumps, and/or interposers. While 3D-SICs offer many attractive advantages with respect to heterogeneous integration, smaller form-factor, higher band... »

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