Design and Test Solutions are Trending in 3D ICs
These days, as I troll the pages of the Internet in search of juicy tidbits of 3D IC news and information, I’ve realized that with the exception of that pesky issue with thin wafer handling, focus has moved away from novel manufacturing processes, and turned its magnifying glass onto the...Perspectives on 3D Integration: The Researchers
To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for technology that rivals no other; except perhaps that of Rao Tummala of Georgia Tech. But John is definitely more vocal in his passion. Rao has a softer, gentler approach. At...Ultratech Achieves ISO 9001 and 14001 Certification for Singapore Operations and Recertification for U.S. Facility
Ultratech has earned ISO 9001:2008 and 14001:2004 certification from the DQS-UL Group for its international operations headquarters in Singapore and recertification for its San Jose facility. Ultratech recently announced the opening of its Singapore operations, which includes engineering and manufacturing of its lithography systems and other related products, in addition...3-D chips and Evolving Test Strategies Take Center Stage at ITC
Program chair Erik Volkerink of Verigy discusses this year's International Test Conference in an interview with Rick Nelson, Chief Editor, Test and Measurment World. The testing of 3-D chips, protocol-aware test, and concurrent test will be key topics on the agenda of the 41st International Test Conference October 31 through...DATE’10 3D Integration Workshop addresses applications, technology, architecture, design, automation, and test’
3D Workshop organizers Erik Jan Marinissen (IMEC), Yann Guillou (ST-Ericsson) Geert Van der Plas (IMEC) report back from a very successful second year at DATE, 2010 in Dresden, Germany.
Bringing Transparency to 3D Integrated Structures – Olympus Confocal IR Microscopy
Metrology is consistently one of the more challenging areas in the semiconductor field. Whether it’s the monitoring of ultra-small features and defects, or inspecting the backside or bevel of a wafer, the challenges are ever growing. The situation is further complicated by the need for in-line metrology that can...