Test and Inspection

3D TSV Test Approaches: Outlook for 2014

3D TSV Test Approaches: Outlook for 2014

Metrology, process control, and electrical test are key enablers for the success of the semiconductor industry. 3D integration using TSVs offers new challenges in this area that need solutions. There seems to be industry consensus that it is extremely difficult to perform a wafer-level test that ensures the complete functionality of the TSVs. There are ideas about how to perform 3D TSV test with ... »

Rudolph Technologies’ Metrology, Inspection and Lithography Solutions for 2.5D and 3D TSVs
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Rudolph Technologies’ Metrology, Inspection and Lithography Solutions for 2.5D and 3D TSVs

Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D and 3D packaging technologies are changing the requirements for manufacturing tools in the back-end, and in many cases the back-end tools of today are starting to resemble the front-end tools of yesterday. Unfortunately, these tools are still expected to come at back-end tool... »

Probing Questions at the IEEE 3D IC Test Workshop
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Probing Questions at the IEEE 3D IC Test Workshop

As this year’s 3D IC Test Workshop unfolded (September 12 & 13, 2012), one thing became increasingly clear to me: the challenge of probing microbumps is an item of critical concern in 3D test. During the panel discussion on test requirements for 3D ICs, Saman Adham of TSMC Canada, noted that currently, microbump probing is extremely difficult and we need a better way to probe. Qualcomm’s A... »

Multitest’s Next Phase: An Interview with Reinhart Richter
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Multitest’s Next Phase: An Interview with Reinhart Richter

This past July, I visited Multitest’s San Jose location to learn about the company’s activities in 3D IC test, as well as gain a better understanding of the company’s Plug & Yield™ philosophy, which spans handler, contactor and load board technologies. Earlier this month, the company announced its acquisition by LTX-Credence, along with its sister company, Everett Charles Technolog... »

Multitest: Handling the Mobility Market
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Multitest: Handling the Mobility Market

What better way to wrap up a busy week at SEMICON West 2013 than a site visit? After three days of interviews and PowerPoints, I was ready for some some hands-on demonstration. Barbara Loferer, marketing manager of Multitest, was concluding an open-house week at the company’s San Jose facility to promote the company’s current focus on the mobility market and subsequent product enhancements, a... »

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