Jul 18, 2013 · By Francoise von Trapp · 3D Event Coverage
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. As 3D ICs get closer to volume manufacturing, we’re seeing newcomers joining the 3D IC party with solutions that help along established process flows, and fill in gaps. Longtime suppliers to the mainstream...Jul 17, 2013 · By Francoise von Trapp · 3D Event Coverage
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought leaders in 3D ICs, as well as manufacturing suppliers who have the onerous task of developing, promoting, and selling the next great solution for 2.5D and 3D IC manufacturing. Over...Jul 16, 2013 · By Francoise von Trapp · 3D Event Coverage
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization of 3D ICs gets pushed out further, will it be Silicon Photonics that drives 3D ICs to volume manufacturing? That was the opinion expressed by Michael Liehr, executive VP of...Jul 15, 2013 · By Francoise von Trapp · 3D Event Coverage
Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge to witness the inaugural 3D InCites Awards Breakfast, held July 11, 2013 during SEMICON West. For me, it was especially significant as it marked four years since I first launched...Jul 12, 2013 · By Kamal Karimanal · 3D Event Coverage
SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on ensuring that all pieces of the 3D IC puzzle are in place. This was evident from the range of presenters they had lined up during this year’s Technology Forum, held...Jul 08, 2013 · By Francoise von Trapp · 3D Event Coverage
New this year at SEMICON West, and just introduced to the program late last week, the Expert TechHUBs will help attendees find answers to specific semiconductor test and packaging questions. Meet with industry experts in an informal discussion group on the North Hall show floor at TechHUB Test or in...Jul 05, 2013 · By Francoise von Trapp · 3D Event Coverage
That Jan Vardaman, she’s so clever! I just finished reading her column on ECTC 2013 in Printed Circuit Design and Fab, and thought her quippy, Las Vegas-y references in the opening paragraph were right on the money. Vardaman’s take on ECTC was similar to my own, discussed here in my...Jul 02, 2013 · By Francoise von Trapp · 3D Event Coverage
Subscribers are practically blowing up 3D InCites as they duke it out online and race the July 3rd deadline for casting their ballots in the public opinion poll for this inaugural 3D InCites Awards; which is great because the first 3D InCites Awards Breakfast, co-presented by 3D InCites and TechSearch...Jul 01, 2013 · By EV Group · Manufacturing
Three high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enable greater manufacturing flexibility St. Florian, Austria, July 1, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced...Jun 21, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description Cascade Microtech’s 3D probing solution, comprising the CM300 probe station and Pyramid Probe® cards with RBI technology, captures the true electrical performance of devices and helps produce high-integrity data. The CM300 achieves hands-off productivity to probe 3D stacked devices, using PTPA to successfully probe 25µm diameter micro-bumps. Testimonial...Jun 20, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description CoatsClean ER105 is a wet resist and residue remover that has been successfully used to remove post-Bosch and post-RIE etch residue created in the formation of TSVs. It offers good process margin, allowing it to be incorporated into both spray and immersion, singe wafer and batch-type process. Testimonial...Jun 20, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies in December 2012. Copper DBI® technology offers higher throughput and better scalability when compared to copper thermo-compression bonding. This technology can be incorporated into die-to-die, die-to-wafer and wafer-to-wafer processes. Testimonial...Jun 19, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric ambient prior to bonding. Proven effective on many elemental metals and their alloys, this tool cleans and passivates bonding surfaces rapidly and safely without damaging critical layers. Testimonial To achieve high-density...Jun 19, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description Alchimer’s eG3D Polymer simplifies the metallization process flow for deposition processes for TSV insulation and barrier by combining the material properties of electrografting (eG) insulation and chemicalgrafting (cG) barrier technologies into a single step process. eG3D Polymer wet processes achieve favorable insulation and barrier properties at a reduced...Jun 19, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description The Virtex-7 H580T FPGA is the first 3D heterogeneous all programmable device, featuring up to eight 28 Gbps and 48 13.1 Gbps transceivers, making it the only single-chip solution to provide customers with the system integration to meet space, power and cost challenges of transitioning to 100G CFP2...Jun 18, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description The EVG850TB/DB XT temporary bonding/debonding platform addresses the high volume manufacturing needs for thin wafer processing. Nine process modules combined with integrated FOUP storage system allow true continuous mode of operation with an unprecedented throughput of >40 bonds/debonds per hour. The EVG850TB/DB XT supports all common bonding adhesives...Jun 17, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description Cadence Encounter Test provides a comprehensive methodology for 3D-IC design-for-test and automatic test pattern generation that includes a DfT architecture that controls and observes an individual die from the chip I/Os, different test modes to control application of tests up and down the stack, and interconnect tests to...Jun 13, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description The InStrip3D utilizes the experience gained from a well-established installed base of high-parallel InStrip/InMEMS solutions. The architecture of the InStrip allows the configuration of the system to meet the special requirements of partial stack test with respect to the extremely sensitive bare dies. Testimonial Multitest is the first...Jun 13, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description The NSX 320 Metrology Series combines macro inspection and 3D metrology for advanced packaging applications. The demonstrated 3D measurement capability from Tamar Technology is now incorporated onto the industry standard NSX Macro Inspection System to offer a complete 2D/3D inspection and metrology solution for unique advanced packaging process...Jun 11, 2013 · By Francoise von Trapp · 3D In-Depth
Product Description Tessent Memory BIST (built-in self-test) allows you to test and diagnose failures in memory die and in the through-silicon-via (TSV) connections between the memory and logic die within a stacked package. This solution supports any memory stacking configurations without any change to the test infrastructure Testimonial The Tessent...