Processes and Technology

TSV Inspection

NORDSON: Newcomers to 3D ICs

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. As 3D ICs get closer to volume manufacturing, we’re seeing newcomers joining the 3D IC party with solutions that help along established process flows, and fill in gaps. Longtime suppliers to the mainstream...

Momentum Builds for the 2013 3D InCites Awards

Subscribers are practically blowing up 3D InCites as they duke it out online and race the  July 3rd deadline for casting their ballots in the public opinion poll for this inaugural 3D InCites Awards; which is great because the first 3D InCites Awards Breakfast, co-presented by 3D InCites and TechSearch...

EV Group Enhances Wafer Debonding Solutions Portfolio with New LowTemp Room-Temperature Debonding Platform

Three high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enable greater manufacturing flexibility St. Florian, Austria, July 1, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced...

Cascade Microtech: CM300 Probe System

Product Description Cascade Microtech’s 3D probing solution, comprising the CM300 probe station and Pyramid Probe® cards with RBI technology, captures the true electrical performance of devices and helps produce high-integrity data. The CM300 achieves hands-off productivity to probe 3D stacked devices, using PTPA to successfully probe 25µm diameter micro-bumps. Testimonial...

Dynaloy, LLC: CoatsClean

Product Description CoatsClean ER105 is a wet resist and residue remover that has been successfully used to remove post-Bosch and post-RIE etch residue created in the formation of TSVs. It offers good process margin, allowing it to be incorporated into both spray and immersion, singe wafer and batch-type process. Testimonial...

Ziptronix: Copper DBI Technology for 3D Memory Assemblies

Product Description Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies in December 2012. Copper DBI® technology offers higher throughput and better scalability when compared to copper thermo-compression bonding. This technology can be incorporated into die-to-die, die-to-wafer and wafer-to-wafer processes. Testimonial...

SET North America: ONTOS7 Surface Preparation System

Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric ambient prior to bonding.  Proven effective on many elemental metals and their alloys, this tool cleans and passivates bonding surfaces rapidly and safely without damaging critical layers. Testimonial To achieve high-density...

Alchimer: eG3D Polymer

Product Description Alchimer’s eG3D Polymer simplifies the metallization process flow for deposition processes for TSV insulation and barrier by combining the material properties of electrografting (eG) insulation and chemicalgrafting (cG) barrier technologies into a single step process. eG3D Polymer wet processes achieve favorable insulation and barrier properties at a reduced...

Xilinx: Virtex-7 H580T

Product Description The Virtex-7 H580T FPGA is the first 3D heterogeneous all programmable device, featuring up to eight 28 Gbps and 48 13.1 Gbps transceivers, making it the only single-chip solution to provide customers with the system integration to meet space, power and cost challenges of transitioning to 100G CFP2...

EV Group: EVG850TB/DB XT

Product Description The EVG850TB/DB XT temporary bonding/debonding platform addresses the high volume manufacturing needs for thin wafer processing. Nine process modules combined with integrated FOUP storage system allow true continuous mode of operation with an unprecedented throughput of >40 bonds/debonds per hour. The EVG850TB/DB XT supports all common bonding adhesives...

Cadence Design Systems: Encounter Test

Product Description Cadence Encounter Test provides a comprehensive methodology for 3D-IC design-for-test and automatic test pattern generation that includes a DfT architecture that controls and observes an individual die from the chip I/Os, different test modes to control application of tests up and down the stack, and interconnect tests to...

Multitest: InStrip3D

Product Description The InStrip3D utilizes the experience gained from a well-established installed base of high-parallel InStrip/InMEMS solutions. The architecture of the InStrip allows the configuration of the system to meet the special requirements of partial stack test with respect to the extremely sensitive bare dies. Testimonial Multitest is the first...

Rudolph Technologies: NSX 320 Metrology Series

Product Description The NSX 320 Metrology Series combines macro inspection and 3D metrology for advanced packaging applications. The demonstrated 3D measurement capability from Tamar Technology is now incorporated onto the industry standard NSX Macro Inspection System to offer a complete 2D/3D inspection and metrology solution for unique advanced packaging process...

Mentor Graphics: Tessent MemoryBIST

Product Description Tessent Memory BIST (built-in self-test) allows you to test and diagnose failures in memory die and in the through-silicon-via (TSV) connections between the memory and logic die within a stacked package. This solution supports any memory stacking configurations without any change to the test infrastructure Testimonial The Tessent...