Nov 21, 2023 · By Phil Garrou · Blogs
TSMC recently introduced its “3DFabric Alliance”, as part of its Open Innovation Platform (OIP), to help customers with the challenges of semiconductor and system-level design complexity. The intention is to achieve rapid design implementation for next-generation HPC and mobile applications using TSMC’s “3DFabric™ technologies. Specifically, the company lists its goals...Nov 20, 2023 · By Dean Freeman · 3D In Context
My sustainability news feed has been filled with articles regarding COP 28, and news of successes and failures regarding the reduction of CO2 levels in 2023. Most of these are focused on the prospect of missing the 1.5°C target set in Paris, the positives and negatives of carbon capture, the...Nov 15, 2023 · By Julia Freer Goldstein · Blogs
Recovering Noble Metals Apple made an audacious announcement in 2017, publicly stating a goal to eliminate mined rare earth elements from its iPhones. Stating such a goal, without a concrete plan to achieve it, was unheard of coming from the usually secretive Apple. It still isn’t clear how Apple will...Nov 14, 2023 · By Phil Garrou · Blogs
Intel recently announced that it would use glass core substrates for advanced packaging in the second half of this decade. The company reports it has been researching and evaluating the reliability of glass core substrates as a replacement for organic substrates for more than a decade. Intel says that it...Nov 13, 2023 · By Francoise von Trapp · Blogs
In 2023, The International Microelectronics Packaging Society (IMAPS) reinvigorated its Arizona Chapter with monthly events at member sites. So far, I’ve attended lunch at Amkor Technology and more recently, Happy Hour at Deca Technologies. Each event started off with a technology presentation by the host company, followed by networking. In...Nov 09, 2023 · By Francoise von Trapp · Blogs
I have attended my share of DEI and allyship-focused events in the past few years attended by both women and men. In fact, I have moderated a few and recorded several for the 3D InCites podcast. But this was my first SEMI Women in Semiconductors (SEMI WIS) event, and it...Nov 08, 2023 · By Trine Pierik · From Different Dimensions
SEMICON Europa 2023, co-located with productronica in Munich, Germany makes for one of the strongest single events for electronics manufacturing in Europe. Together, SEMICON Europa and productronica showcase the entire spectrum of technologies and solutions for the entire semiconductor and electronics manufacturing industries, reflecting the rapid pace of technological development...Nov 07, 2023 · By Dean Freeman · 3D In Context
September and October are busy months in the technology world, as companies have their annual analyst day, where they show off and introduce new technology. Shortly after the analyst day comes earnings season. This timing gives CEOs the opportunity to use the old adage: Tell them, tell them again, and...Nov 02, 2023 · By Francoise von Trapp · Blogs
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics of the day. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of germanium and gallium restrictions...Nov 01, 2023 · By Trine Pierik · From Different Dimensions
October flew by and our community members were busy… Deca was the recipient of the prestigious IMAPS Corporate Recognition Award in San Diego for its significant technical contributions to the microelectronics industry. Robin Davis, Sr. Director of Business Development at Deca, was also recognized with the impressive IMAPS Emerging Leadership...Oct 30, 2023 · By Phil Garrou · Blogs
Also STEAMPIPE winners and are Japan’s semiconductor materials companies acquisition targets? Arizona talks packaging with TSMC Ever since TSMC announced it was putting an advanced chip fab in Arizona, IFTLE has been screaming to anyone who would listen that this did not make any sense if the chips had to...Oct 25, 2023 · By Phil Garrou · Blogs
Microelectronics Commons The Microelectronics Commons is a Department of Defense (DoD) initiative that aims to create direct pathways to commercialization for U.S. microelectronics researchers and designers. It is a national network designed to: Enable sustained partnerships between emerging technology sources, manufacturing facilities, and interagency partners. Develop a pipeline of talent...Oct 24, 2023 · By Erwan Amade · Blogs
The semiconductor industry lies at the heart of almost every technological innovation of our time. For those looking to delve into this fascinating world, my experience might serve as a guide. My Education: Balancing Science and Commerce My journey began at the IUT Chemical and Process Engineering in Lyon, where...Oct 23, 2023 · By Dean Freeman · 3D In Context
As sustainability matures, the fall of the year seems to be when there is a significant focus on sustainability, culminating in the Conference of the Party (COP) meetings in late November. Companies publish their ESG reports if they have done so earlier in the year. Ratings companies release their rankings,...Oct 19, 2023 · By Julia Freer Goldstein · Blogs
In evaluating companies for the 3D InCites Sustainability Award, we consider progress on four of the UN Sustainable Development Goals (SDGs): Clean Water and Sanitation (6), Affordable and Clean Energy (7), Responsible Consumption and Production (12), and Climate Action (13). Many more of the UN SDGs are directly or indirectly...Oct 18, 2023 · By Phil Garrou · Blogs
This week, we finish our look at papers presented during the IMAPS CHIPCon Conference held in July, 2023, where we focus on North American advanced packaging and new ABF materials. We also applaud the appointment of Dr. Suby Iyer to head up NAPMP, and Dev Palmer’s promotion from within DARPA....Oct 17, 2023 · By Dean Freeman · 3D In Context
It’s been a busy time on the semiconductor industry front: SEMICON Taiwan; Intel’s Innovation Day; glass interposers making it to center stage; TSMC’s Open Innovation Platform with the announcement of the 3Dblox 2.0; and the first CHIPS Act payout by the Department of Defense (DoD) of $238 million to universities....Oct 12, 2023 · By Francoise von Trapp · Blogs
This year’s IMAPS keynotes focused on advancements in heterogeneous integration (HI) technologies and chiplet architectures enabled by HI, driven by the needs of high-performance computing, AI, and automotive applications. While it feels for some of us that we’ve been in the thick of advanced packaging, HI, and the More than...Oct 11, 2023 · By Francoise von Trapp · Blogs
It wasn’t long ago that the IMAPS International Symposium focused mainly on legacy packaging technologies, occasionally dipping its toe in the advanced packaging space. That space was generally left to the IMAPS Device Packaging Conference in March. It was evident in the sessions as well as the exhibit halls. But...Oct 10, 2023 · By Phil Garrou · Blogs
This week, we continue our look at the presentations at the IMAPS CHIPCon conference that was held at the end of July 2023. Here we focused on process tools and EDA for chiplets. Hybrid Bonding at Besi Besi is a global leader in equipment for advanced packaging assembly and equipment...
