3D Topics

IFTLE 429: Samsung 12-layer memory with 3D-TSV; SHIP Winners

Samsung Electronics has announced the development of 12-layer memory using 3D through silicon via (3D-TSV) chip packaging technology. TSVs vertically interconnect the two DRAM chips through more than 60,000 TSVs. Despite the increase in the number of layers from eight to 12, the overall thickness of the package remains at...

IFTLE 428: Panel Level Processing: We’ve Come A Long Way Baby!

It was in 1992 when Ted Tessier and I, in our paper, “Overview of MCM Technologies: MCM-D”, at the IMAPS Symposium in San Francisco, drew the analogy to the evolving LCD industry. “The LCD industry had spawned the development of a whole new class of large format, high-throughput thin-film processing...

Highlights from EDPS 2019

The Electronic Design Process Symposium – EDPS 2919 – is known in the IC design community as a rather small (50 – 100 participants), but a highly interactive workshop. The 26th edition, hosted again this year by SEMI at its Milpitas headquarters, October 3 -4, 2109 featured both EDPS IC design...

How 5G is Enabling a Connected World

It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on the success of 5G. 5G will make smart factories more efficient; bring medical care to remote places; make the autonomous vehicle infrastructure possible so you stop rear-ending the person in...

CES 2019: Taiwan Becoming Tech Gateway To Asia

There is no shortage of innovation in Southeast Asia, but as Dr. Lewis Chen, Managing Director of Taiwan Tech Arena explains, it takes a unique blend to be truly successful. By focusing intensely on solving real problems, leveraging homegrown engineering and technology expertise, and collaborating globally using Accelerators to overcome...

IFTLE 427: TSMC’s Next-Gen 3D Technology – N3XT

Continuing our look out into the future, at the recent Hot Chips Conference, Dr. Phil Wong, VP of R&D at TSMC gave a presentation entitled “What Will the Next Node Offer Us?” where he discusses the use of chiplets, 3DICs, and a futuristic technology for the heterogeneous integration of memory and...

The Decade Ahead: Emerging MEMS and Sensors Technologies to Watch

Most of today’s blockbuster MEMS products—from pressure sensors and resonators to accelerometers and microphones—originated from academic research, a trend that Alissa M. Fitzgerald, Founder & Managing Member, A.M. Fitzgerald & Associates, expects to continue. While many of these potentially game-changing new technologies will require many more years of intensive development...

Strategic Materials Conference Focuses on Complex Challenges

Materials have a major impact on reliability, performance, cost and other key parameters of electronic solutions. SEMI’s recent Strategic Materials Conference (SMC 2019) brought materials suppliers and their customers together to discuss progress made in these areas. They also addressed how to solve the increasingly divergent and complex challenges current...

Reaping the Benefits of a Design and Manufacturing Ecosystem

As it does each year, TSMC recently brought 45 of its ecosystem partners together for its annual Open Innovation Platform® Forum to demonstrate to joint customers the value of a well-managed IC design and manufacturing ecosystem. TSMC and many of the partners presented recent accomplishments and explained in 33 technical...

Q2 2019: Memory Business is Approaching the Bottom

“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as sluggish demand and elevated inventory levels continued to plague the memory markets”, announces Simone Bertolazzi, Memory Technology & Market Analyst at Yole Développement (Yole). What is the latest news on...

Exhibitor Highlights at IMAPS International Symposium

The 52nd International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week. Key package platforms will include system-in-package (SiP), system in module (SiM). chip-package interaction (CPI), wafer level/panel Level, 2.5D/3D/flip chip/optical, as well as high reliablity/performance, and advanced process/materials. IMAPS 2019 will host...

A Look at US Investments in Heterogeneous Integration

The semiconductor industry is not only very capital-intensive, but investors experience very long payback times. Both limit the availability of private funding. If you are jealously looking at China and the billions of dollars they invest in semiconductors, I recommend you make a closer study of US investments in heterogeneous...

The Path to Smarter Fabs

Working from the mantra “None of us knows as much as all of us,” SEMI invited manufacturers of electronic components and systems to come together and discuss how to build smarter fabs and reap key benefits like lower cost, faster turnaround as well as higher quality and more reliable products....

Supporting the 3D Megatrend in Semiconductor Manufacturing

We’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing, as scaling alone does not meet the sophisticated computing needs of Industry 4.0 applications like blockchain, 5G, the internet of things (IoT), autonomous transportation, telemedicine, and more. These emerging technologies...