3D Topics

HPC, AI and Datacenters: the 2.5D and 3D Stacking Technologies Playground
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HPC, AI and Datacenters: the 2.5D and 3D Stacking Technologies Playground

“2.5D and 3D stacking technologies are the only solutions that meet the required performance of applications like artificial intelligence (AI) and datacenter as of today”, confirms Mario Ibrahim, ... »

Heterogeneous Integration Calls for Increased Materials Reliability
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Heterogeneous Integration Calls for Increased Materials Reliability

Automotive reliability is a pivotal concern for heterogeneous integration technologies, especially as emerging mission profiles for electric and autonomous vehicles push component lifetimes out by two... »

Extending Moore’s Law through Advanced Packaging
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Extending Moore’s Law through Advanced Packaging

The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in lithography and device technology. Today, these technologies are... »

IFTLE 405: DC Hu of SiPlus Classifies Advanced Packaging Technologies at IMPACT 2018
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IFTLE 405: DC Hu of SiPlus Classifies Advanced Packaging Technologies at IMPACT 2018

As scientists, we have a tendency to classify and categorize. It’s our way of comparing and contrasting things in our world. Some of these classifications stick and some don’t. For instance at the... »

KLA Completes Acquisition of Orbotech Ltd.

KLA Completes Acquisition of Orbotech Ltd.

MILPITAS, Calif., Feb. 20, 2019—KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). “We are very pleased to have completed the... »

Thank 2.5D Interposer Technologies for the Success of 3D ICs
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Thank 2.5D Interposer Technologies for the Success of 3D ICs

Would it be flippant to say that the most pivotal event that impacted the commercialization of 3D integration technologies, may have been the commercialization of 2.5D interposer technologies? Arguabl... »

IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP
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IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP

In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR – 1µm RDL Ultratech, IMEC and JSR discussed “One Micron Damascene Redistribution ... »

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Advanced Packaging: at the Heart of Innovation

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and d... »

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio
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Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio

 Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent, wet process tool and its AP300™  l... »

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MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will be ... »

MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies
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MEMS & Sensors Technical Congress Highlights Automotive Market, Emerging MEMS Technologies

This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an explo... »

How Do We Entice Young Women to Pursue Careers in Microelectronics & Packaging?
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How Do We Entice Young Women to Pursue Careers in Microelectronics & Packaging?

If what is expressed during ongoing discussions on gender diversity and inclusion at semiconductor and packaging industry events is true, then the overarching belief is that women are drawn to careers... »

3D Integration Enables More than Moore Technologies

3D Integration Enables More than Moore Technologies

Looking back at the last 10 years, it is very difficult to choose one single event that was the most pivotal for commercializing 3D integration technology. There have been many prior events that have ... »

DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging
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DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging

Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing printed circuit board (PCB) and system designers the latest technology ... »

Advice on Gender Diversity and Inclusion from the Trenches
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Advice on Gender Diversity and Inclusion from the Trenches

From the semiconductor industry panels on gender diversity and inclusion and networking receptions to casual lunches and one-on-one interviews, I’ve been listening to women of all levels of experien... »

IFTLE 403: TSMC 4th Generation CoWoS; 2018 Singapore EPTC Part 1
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IFTLE 403: TSMC 4th Generation CoWoS; 2018 Singapore EPTC Part 1

Heterogeneous Integration spurs demand for 3D backend solutions Julian Ho reported in the Jan 10th issue of Digitimes that heterogeneous integration of diverse semiconductor components to support 5G,... »

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Megatrends are Changing the Future of the Lithography Equipment Market

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the more tha... »

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Fan-Out Packaging is Becoming Imperative to Stay Competitive in Advanced Packaging

“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Dévelop... »

Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration
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Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration

The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous integration, quantum computing, a... »

3D ICs Eliminate the Memory Wall
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3D ICs Eliminate the Memory Wall

The adoption of 3D ICs allowed the elimination of the “Memory Wall” using a new memory architecture and through silicon via (TSV) technology. While individual ICs became faster with each process n... »

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