Jan 16, 2024 · By Phil Garrou · Blogs
As IFTLE has explained previously, Investments in semiconductors will not succeed without investments in advanced packaging. The CHIPS for America program, agreeing with this premise, has announced that it will support the development of advanced packaging technology in the United States that can be transferred to manufacturing facilities, including recipients...Jan 15, 2024 · By Francoise von Trapp · Blogs
As they do every year, semiconductor industry leaders gathered in Half Moon Bay, CA in early January for SEMI ISS 2024 to take stock of the economic trends and market drivers to set their corporate strategies for 2024. Appropriately, the weather outside the Ritz-Carlton, overlooking the Pacific Ocean, matched the...Jan 10, 2024 · By Francoise von Trapp · Blogs
2023 was a year of growth and change for 3D InCites, as well as me personally. In April, I left my role at Kiterocket and the security of a salary and benefits to follow my passion and focus full-time on supporting the 3D InCites Community. It was time, and I...Jan 08, 2024 · By Dean Freeman · 3D In Context
It all depends upon who you talk to at IEDM 2023. The semiconductor chip industry is either moving into a new realm that will be based upon chiplet technology, or the industry is continuing to drive front-end and backend technology forward and the two technologies are morphing together to drive...Jan 04, 2024 · By Bob Patti · Blogs
Challenges to 3DHI and chiplets remain, but new advanced packaging foundry solutions are stacking up The industry consensus is that the path to extending Moore’s Law lies in heterogeneous integration (HI) and chiplet architectures. Why, then, are we still waiting for the full adoption of HI, 3DHI, and chiplets? The...Jan 02, 2024 · By Tessa Baltussen · Blogs
The “Global Talent Shortage” is a buzzword that everybody uses nowadays. But what does it mean? The most used definition I found was that employers cannot find the people they need with the right blend of technical skills and human strengths. The talent shortage is a significant concern in the...Dec 28, 2023 · By Phil Garrou · Blogs
NIST held the “Chiplet Interfaces Technical Standards Workshop” at the NIST National Cybersecurity Center of Excellence in December 2023. During this workshop, technical experts from industry, academia, standards-setting organizations, and industry alliances gathered to discuss and prioritize specific standards efforts related to chiplet-based architectures with a focus on physical and logical...Dec 21, 2023 · By Phil Garrou · Blogs
The Scalable Asymmetric Lifecycle Engagement (SCALE) program is the nation’s preeminent workforce development effort, funded by the Department of Defense’s (DoD) Trusted and Assured Microelectronics program and managed by the Naval Surface Warfare Center, Crane Division. SCALE has a mission to bolster next-generation workforce development to bring the United States...Dec 20, 2023 · By Dean Freeman · 3D In Context
The Semiconductor industry has been ramping up its focus on sustainability for the past three to four years. Strong sustainability efforts have been in place for ST Microelectronics and Intel since 2011 and have trickled down to their suppliers through a sustainability focus on the supply chain. When Apple and...Dec 19, 2023 · By Katie Naugton · Blogs
SEMI launched its 20 Under 30 Award Program at SEMICON West in 2022 to recognize the industry’s brightest young leaders who demonstrate outstanding leadership, practice productive collaboration, exhibit a commitment to success, make a significant difference, and actively engage in community. Candidates can come from different areas of the microelectronics...Dec 13, 2023 · By Julia Freer Goldstein · Blogs
For our industry to fully embrace environmental sustainability, we need the entire supply chain involved. The industry giants can make all the proclamations they want, but without the support of their suppliers and their suppliers’ suppliers, they will find it very difficult to achieve their goals. Equipment is central to...Dec 12, 2023 · By Phil Garrou · Blogs
Also: US CHIPS Seeking < $300M Proposals TSMC’s Offshore Fabs Nikkei Asia is reporting that TSMC’s $8B Japan chip project steams ahead as its U.S. site continues to hit snags. TSMC has launched significant global expansion in the U.S., Japan, and Germany to address growing customer demand and diversify production...Dec 11, 2023 · By Francoise von Trapp · Blogs
One of the best things about being headquartered in Phoenix, AZ is having a front-row seat of all the semiconductor industry growth that’s happening. Case in point: Last week (December 3-5) the city hosted one leg of a Netherlands-Flanders Economic Mission to the US that was sponsored by the Consulate...Dec 07, 2023 · By Dean Freeman · 3D In Context
China’s semiconductor industry has been in the news a great deal over the past year. 7nm technology advancements, sanctions, new sanctions, allegations of future dumping of semiconductors, and China is the only region to see year-over-year growth in semiconductor equipment in 2023. Trend Force published a report in early November...Dec 05, 2023 · By Francoise von Trapp · 3D Event Coverage
This episode features conversations with 3D InCites members who attended or exhibited at SEMICON Europa 2023, which took place in Munich, Germany from November 14-17, 2023. The topic of the week was Shaping a Sustainable $1 Trillion Era. Members weigh in on what their companies are doing to support this...Dec 04, 2023 · By Phil Garrou · Blogs
Amkor Technology’s announcement to build a high-volume facility in the US, as well as the award winner announcements for the IBAS RESHAPE program, indicate that advanced packaging is indeed coming onshore in the US. Let’s take a closer look. Amkor Announces US Advanced Packaging and Test Facility Amkor Technology is...Nov 29, 2023 · By Trine Pierik · From Different Dimensions
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers,” and a happy hour of networking. MKS/Atotech was in attendance at the TPCA Show 2023 showcasing advanced process, laser drilling and...Nov 28, 2023 · By Mindy Lok · Blogs
I am passionate about the emerging and leading technology shaping the world. After accepting an internship at Kiterocket, a global PR and marketing agency, I quickly delved into learning about the technical and complex world of semiconductors. This internship allowed me to grow the skills necessary to excel in an...Nov 27, 2023 · By Adeel Bajwa · 3D In-Depth
Modern-day applications such as cloud computing, high-performance computing, artificial intelligence (AI), data centers, and future 6G systems are driving the implementation of advanced packaging schemes such as system-in-package (SiP), 3D-stacking, 2.5D-Interposers, and more. These schemes are not only replacing Moore’s law in driving semiconductor performance but at the same time...Nov 22, 2023 · By Francoise von Trapp · Blogs
At SEMICON Europa 2023, we heard more good news about 3D heterogeneous Integration from speakers at the CEO Summit and the Advanced Packaging Conference. Not only has it become the champion for the continuation of Moore’s Law scaling, but it also allows us to deliver on power performance area and...
