3D Topics

ISS 2019: Semiconductor Industry Faces New Challenges and Opportunities
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ISS 2019: Semiconductor Industry Faces New Challenges and Opportunities

SEMI held its annual Industry Strategy Symposium (ISS 2019) at the Ritz Carlton in Halfmoon Bay, CA January 6-9, 2019. Many high-level executives represented key areas of the electronic products suppl... »

Optimizing Your SoC or ASIC to Design PCBs More Cost Effectively
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Optimizing Your SoC or ASIC to Design PCBs More Cost Effectively

Shrinking silicon process nodes and increasing memory demands are a nightmare for PCB design teams working with custom ASICs or SoCs on high-performance systems. Huge devices with challenging bump and... »

3D Powered: From Image Sensors to Artificial Intelligence
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3D Powered: From Image Sensors to Artificial Intelligence

The widespread deployment of 3D stacked CMOS Image Sensors (CIS) in consumer electronics, namely smartphones, by handset makers domestic (Apple, iPhone) and overseas (Samsung, Galaxy), is certain proo... »

3D InCites Turns 10: A Brief Analysis of the 3D Journey
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3D InCites Turns 10: A Brief Analysis of the 3D Journey

I cannot believe 3D InCites is already turning 10! As wise people say, time flies!  Taking a step back, I have to admit a lot of progress has been made since my first attendance as a young engine... »

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection
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Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

 Wilmington, Mass. (January 8, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the pr... »

IFTLE 401: FOWLP for RF; D2W Hybrid Bonding; FOPLP in Samsung Watch
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IFTLE 401: FOWLP for RF; D2W Hybrid Bonding; FOPLP in Samsung Watch

As its name implies, the International Wafer Level Packaging Conference (IWLPC) initially covered wafer-level packaging (WLP) technologies. As all conferences do, it soon expanded its scope to cover b... »

Fan-out Panel Production Becomes a Reality

Fan-out Panel Production Becomes a Reality

Fan-out panel level production is underway at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications.  The Samsung Galaxy watch uses... »

Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium
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Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium

The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturin... »

How Do We Improve Gender Diversity and Inclusion in the Semiconductor Industry?
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How Do We Improve Gender Diversity and Inclusion in the Semiconductor Industry?

In 2018, gender diversity and inclusion (D&I) ranked right up there with artificial intelligence, autonomous cars, and panel-level packaging as a hot-button topic for panel discussions at most of ... »

Happy Holidays, from all the elves at 3D InCites!

Happy Holidays, from all the elves at 3D InCites!

The semiconductor industry could learn a few things from Santa’s elves. How about devices that package themselves? These guys may be onto something. Check it out. »

Polymeric Materials: Massive Adoption by the Advanced Packaging Industry
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Polymeric Materials: Massive Adoption by the Advanced Packaging Industry

According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards f... »

Advanced Packaging Technologies are Key for Semiconductor Innovation
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Advanced Packaging Technologies are Key for Semiconductor Innovation

“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part of Yole Développement (Yole).“The marke... »

Implementing High-Density Advanced Packaging for OSATs and Foundries
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Implementing High-Density Advanced Packaging for OSATs and Foundries

Moore’s law is increasingly difficult to maintain and is driving the growth of innovative, high-density advanced packaging technologies in response to system scaling demands. These innovations are i... »

Rudolph’s NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

Rudolph’s NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

Wilmington, Mass. (12/11/2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the receipt of over $12M in new orders for its recently-released NovusEdge™ system for edge and backside in... »

IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here
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IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here

At the Intel “architecture day” held Dec 12th in Santa Clara, Intel finally announced what some of us have been waiting for, literally for over a decade. The Foveros Backstory In late 2006, CEO Pa... »

Replacing NMP: Are You Ready?
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Replacing NMP: Are You Ready?

NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an effective and versatile cleaning agen... »

TechSearch International Explores Power Device Packaging and Assembly Trends

TechSearch International Explores Power Device Packaging and Assembly Trends

Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in overall leadframe package shipments from 2017 to 2021 for power device ... »

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing
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EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all-new BONDSCALE™ automated production fus... »

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications
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EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the ... »

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies
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Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP – Innovations for High-Performance ... »

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