3D Topics

IFTLE 434: Process Optimization for a Reliable NXP FOWLP Microcontroller

There are several different fan-out wafer-level packaging (FOWLP) technologies that are currently in high-volume production. The traditional fan-out (FO) technology as initially developed by Motorola and Infineon was a face down, die-first technology that has been in volume production for low-end baseband, PMIC, Codec, Wi-Fi, RF kind of applications since...

Talking about Neural Networks and SoC Design Challenges

Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry experts, Anand Joshi and Tom Dillinger, addressed today’s hot topics —neural networks and System-on-Chip (SoC) design challenges — with short, but very informative presentations. Can...

IFTLE 431: Samsung Qualifies EDA Tools for Multi-die Integration

Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial intelligence (AI) and high-performance computing (HPC). They also report a need for new electronic design automation (EDA) solutions because the traditional design doesn’t fully address the latest power and signal...

IFTLE 430: Exascale Computing in Europe: Leading Edge Packaging is the Key!

Beyond HPC High-performance computing (HPC) has become an important tool for areas that generate high volumes of data. While today’s HPC is already powerful, many scientific and industrial challenges require even more computing power, for instance, drug discovery and material design. Thus, the global drive for exascale (1018) computing. HPC...

As a Pioneer in EDA, Dr. Mary Jane Irwin Pays it Forward

Tomorrow evening (Nov. 7, 2019), Dr. Mary Jane Irwin will take the stage at a dinner being held in her honor, as she becomes the first woman to ever receive the 2019 Phil Kaufman Award for Distinguished Contributions to Electronic System Design. The award is presented annually by the Electronic...

SEMICON Europa on Preview…

Co-located with productronica in Munich, Germany, SEMICON Europa attracts and connects industry-leading technology companies from every segment of the European microelectronics industry. Held November 12-15, this year’s events will expand attendee opportunities to exchange ideas and promote technological progress featuring the most advanced and innovative electronics manufacturing platform in Europe,...

The IWLPC Fan-out PLP Smack Down

At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies. Fan-out PLP (FO PLP)...

The World Series 2019: The Technology of Baseball

I’m a huge baseball fan. And while my favorite team, the Arizona Diamondbacks didn’t even make it into the playoffs, it doesn’t mean I’m not glued to my MLB app to keep track of the World Series. I LOVE IT!  ALL OF IT!  The plays, the jockeying for position, the...