3D Topics

The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors
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The ECTC Time Machine: Lead-free Solder, Environmental Reporting, and Next-Generation Sensors

Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth, I talked to people I’ve known for decades and others I was meeting for the first time. By v... »

The Importance of a Well-coordinated Semiconductor Supply Chain
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The Importance of a Well-coordinated Semiconductor Supply Chain

Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard and/or ketchup and veggies from the nearest supermark... »

Heterogeneous Integration Component Flavors SEMI ASMC 2019
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Heterogeneous Integration Component Flavors SEMI ASMC 2019

“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected. The availability of large functions, combined with functional d... »

Moore’s Law is Dead (Again), Chiplets are Hot, and other Highlights of ECTC 2019
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Moore’s Law is Dead (Again), Chiplets are Hot, and other Highlights of ECTC 2019

In the blink of an eye, the 69th Electronics Component Technology Conference (ECTC 2019) has come and gone in a swirl of presentations, conversations, and networking events. Last week, (May 27-31, 201... »

IFTLE 415:Substrate-like PCBs; Three Top Ten Packaging Houses are China-based
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IFTLE 415:Substrate-like PCBs; Three Top Ten Packaging Houses are China-based

Substrate-like PCBs (SLP) is a term describing a high-density printed circuit board (PCB) that has feature sizes close to that of an IC substrate. The main difference between a PCB and an IC substrate... »

TechSearch International Analysis Predicts Growth for Fan-in WLP and FO-WLP
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TechSearch International Analysis Predicts Growth for Fan-in WLP and FO-WLP

TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLPs (FO-WLPs).  Despite lower growth for smartphones, growth continues as the number of WLPs... »

Book Review: Handbook of 3D Integration – Volume 4
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Book Review: Handbook of 3D Integration – Volume 4

An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing the Handbook of 3D Integration ... »

IFTLE 414: Lester the Lightbulb… Revisited 
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IFTLE 414: Lester the Lightbulb… Revisited 

In the past few weeks, a reader sent a message to IFTLE titled “Time to bring back Lester the Lightbulb” with a link to a story in the Detroit News. Way back in Aug of 2011, I was covering the for... »

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019
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EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration... »

Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing
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Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing

While I’m only four chapters into Material Value written by my colleague and SemiSister, Julia Goldstein, I decided to write the review before I finish reading the book, because Julia will be at ECT... »

Women in Semiconductors: A Rising Tide Will Lift All Boats
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Women in Semiconductors: A Rising Tide Will Lift All Boats

Like most career women, balancing work and family life is a juggling act, leaving precious little time for hobbies. However, I’ve recently acquired quite a knack for managing NFL fantasy football te... »

A Non-Techie SemiSister Tackles The Elusive Semiconductor Language
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A Non-Techie SemiSister Tackles The Elusive Semiconductor Language

Not all SemiSisters are engineers. In fact, many of us joined this industry from a variety of career backgrounds with non-STEM educations including financial, business management, market research, mar... »

Trymax Receives Multi-System Orders from a Top Ten OSAT

Trymax Receives Multi-System Orders from a Top Ten OSAT

NIJMEGEN, THE NETHERLANDS – May 15, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2000 an... »

3D Test: No Longer a Bottleneck!
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3D Test: No Longer a Bottleneck!

When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits (ICs), there were only a few test folks active in that emerging field. Consequently, mi... »

U2U 2019 Conference Dives into 2.5/3D IC Design
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U2U 2019 Conference Dives into 2.5/3D IC Design

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor... »

IFTLE 413: Beware of Technology Hype for the Automotive Market
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IFTLE 413: Beware of Technology Hype for the Automotive Market

As packaging practitioners/experts themselves, regular readers know that IFTLE is always on the lookout for the latest applications and the latest chips going into those applications because all those... »

ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging
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ECTC 2019 Will Go Back to Basics to Plan for the Future of Microelectronics and Packaging

Whoa! Where did the time go? ECTC 2019 is only three weeks away and I haven’t written my annual preview post! This year’s event takes place at the Cosmopolitan in Las Vegas, from May 28-31. I’m ... »

ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options
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ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options

At the recent IMAPS Device Packaging Conference in Fountain Hills, AZ. Kyung Suk (Dan) Oh, Package Development VP at Samsung, discussed “Electronics Packaging Technologies for the 4th Industrial Rev... »

Be a Champion for Change – Highlights from the First SEMI Diversity and Inclusion Forum
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Be a Champion for Change – Highlights from the First SEMI Diversity and Inclusion Forum

Everyone found their seat as SEMI President and CEO, Ajit Manocha, took the stage to kick off the first SEMI Diversity and Inclusion Forum. Ajit has a lifelong passion for diversity and inclusion. He ... »

TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation
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TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation

In 1994 TSMC, a small wafer foundry from Taiwan held its first Technology Symposium. Since 1999 I have had the privilege to work with TSMC and closely follow their success in building a powerful and c... »

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