Materials

Figure 2: Shows the photo of a 50 μm thin wafer after debond on a tape.

Dow Corning offers the Power of Silicone Technology

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview with imec’s Ludo Deferm, I met up with Andrew Ho, global industry director, advanced semiconductor materials, for Dow Corning’s Electronic Solutions, to get an update on Dow Corning’s developments in...

Momentum Builds for the 2013 3D InCites Awards

Subscribers are practically blowing up 3D InCites as they duke it out online and race the  July 3rd deadline for casting their ballots in the public opinion poll for this inaugural 3D InCites Awards; which is great because the first 3D InCites Awards Breakfast, co-presented by 3D InCites and TechSearch...

Dow Corning: Temporary Bonding Solution

Product Description Dow Corning temporary bonding solution is a bi-material silicone based technology featuring low cost of ownership and room temperature bonding and debonding. The chemical and thermally stable materials are spin-on type and can be use for wafer thinning down to 50um providing a global TTV of 2um on...

Triton Micro Technologies: Through-glass-via (TGV) interposer

Product Description Triton Micro Technologies’ ultra-thin through-glass-via (TGV) interposers create 3,000 or more I/O connections per device for high-density IC packaging. Triton uses micro-drilling and via-fill technologies to manufacture 2.5D and 3D TGV interposers for MEMs, RF and optics applications on wafers up to 300mm with thicknesses of 0.7mm and...

Technology Updates at ECTC 2013

The ECTC 2013 stats are in. This year showed increases across the board with: Over 1,300 attendees, the highest attendance ever, from 26 countries 377 technical papers, presented in 36 oral and five interactive presentation sessions, including a student poster session 12 sessions focused on 3D/TSV, including several of the...

2013 Predictions for 3D ICs as reported by SPN

While most of the semiconductor trade publications wrapped up their 2013 prediction posts by mid January, Semiconductor Packaging News (SPN) forged on with its original annual Viewpoints series right up until last week. I spent some time pouring over the musings of industry executives’ contributions. Many discuss the proliferation of mobile...