Feb 04, 2013 · By Francoise von Trapp · 3D Event Coverage
It had been awhile since I heard from the folks at Alchimer about the progress of electrografting (eG), its “all wet” nanometric film deposition processes. For a while, it seemed like there were exciting things to report every few months, and then POOF – All went dark. So I was...Jan 08, 2013 · By Francoise von Trapp · 3D In-Depth
It’s that time of year again when various electronics trade publications invite industry executives to peer into their crystal balls and make their predictions for the coming year. I’ve been perusing through everything from overall industry forecasts by market analysts to suppliers eager to promote their core competencies for 3D...Dec 21, 2012 · By Francoise von Trapp · 3D Event Coverage
It’s too bad SUSS MicroTec’s Wilfried Bair was one of the last presenters on Friday at 3D Architecures for Systems in Packaging Symposium (3DASIP), Dec. 14, 2012, because more people should have been present to hear what he had to say. While most presenters focused on successes and future work...Oct 23, 2012 · By Francoise von Trapp · Manufacturing
But first, a 3D history lesson thanks to a recent SemiWiki blog post, Hybrids on BeO then, 3D-IC in silicon now, in which blogger Don Dingee recalls lessons learned from working with hybrid microelectronics assemblies, and how they apply in the world of 3D. Calling 3D ICs “the modern version of...Oct 09, 2012 · By Francoise von Trapp · 3D In-Depth
It’s been one of those Mondays. I started making the coffee this morning (put in a clean filter, poured in the water) before I got sidetracked and hit the shower without ever putting in the grounds or turning it on. Then I left the Impress Labs office without my key...Sep 20, 2012 · By Francoise von Trapp · 3D In-Depth
I always hesitate to cove 3D transistors, because before they came along, I only focused on what I knew to be 3D – ie: 3D stacked packages, 2.5D interposers and 3D ICs. And that was confusing enough. But then along came Intel’s Tri-Gate technology, claiming the 3D moniker as its...Sep 10, 2012 · By Francoise von Trapp · 3D Event Coverage
SEMICON Europa got underway yesterday, and reports from the event point to new materials, 450mm and 3D ICs as the key topics – all from the European perspective. According to SEMI Europe President, Heinz Kundert, Europe has reached a critical crossroads where its very future as a global competitor seems...Aug 14, 2012 · By Francoise von Trapp · 3D In-Depth
I’ve come across a few interesting announcements in the 3D space today that separately are just random bits of news, but when bundled together, demonstrate acceleration to 3D commercialization. When you think about it, we’re more than halfway to Q1 2013, which has been earmarked by Micron as when 2...Mar 20, 2012 · By Francoise von Trapp · 3D In-Depth
There has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with silicon, that there was an entire session dedicated to developments in that area at the 2012 IMAPS International Device Packaging conference, held March 5-8 in Scottsdale, AZ. Rao Tummala, of...Dec 21, 2011 · By Francoise von Trapp · 3D In-Depth
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the company’s progress with its direct bonding technologies. Paul presented on Day 2 of the conference, but honored me with a one-on-one explanation on the application space enabled by the company’s...Oct 13, 2011 · By Francoise von Trapp · 3D In-Depth
To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for technology that rivals no other; except perhaps that of Rao Tummala of Georgia Tech. But John is definitely more vocal in his passion. Rao has a softer, gentler approach. At...Aug 22, 2011 · By Francoise von Trapp · 3D In-Depth
At SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being developed at Georgia Tech, claimed to be simpler and cheaper than 3D ICs with TSV for many mobile and consumer applications at SemiconWest 2011. in his presentation, Tummala discussed the...Jul 27, 2011 · By Francoise von Trapp · 3D In-Depth
“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate Technology Development and IP Director, EVG, at SEMICON West for a full briefing of the company’s latest corporate and technology developments. Remaining true to their mission of “invent, innovate, implement”...May 30, 2011 · By Francoise von Trapp · 3D In-Depth
Alchimer’s latest technology breakthrough is an interesting twist on the way semiconductor solutions generally presents themselves. We’re used to hearing about scaling that goes from bigger to smaller. This is the first time I’ve heard of a technology that scales UP to meet application needs. But that’s precisely the differentiation...Mar 23, 2011 · By Francoise von Trapp · 3D In-Depth
As chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields and the ability to stack dies of different sizes — especially in memory/logic stacks — a number of approaches have been or are being developed by various collaboratives. At IMAPS...Feb 02, 2011 · By Francoise von Trapp · 3D In-Depth
When it comes to 3D chip stacking, chip-to-wafer (C2W) processes have proven to be the way to go for stacking known-good-die (KGD) for best yields, or if the dies being stacked are of different size. Unfortunately, sequential C2W processes have historically been time consuming, achieving low throughput; making it a...Dec 04, 2010 · By Francoise von Trapp · 3D In-Depth
SPP Process Technology Systems Ltd. (SPTS), announced shipments of US$40 million during the first quarter of 2010. SPTS was formed in October 2009 to merge Surface Technology Systems plc (STS) and assets acquired from Aviza Technology, Inc., including the single wafer process equipment subsidiary Aviza...Oct 18, 2010 · By Francoise von Trapp · 3D In-Depth
I caught up with Alchimer CEO, Steve Lerner last week at the IWLPC in Santa Clara, to find out how things have progressed since news of Panasonic Investment Partners’ equity investment in the company back in July. It turns out setting up shop in Asia has been a great strategic...Sep 27, 2010 · By Francoise von Trapp · 3D In-Depth
This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when it came to technology advancements themselves, I noticed that not much exciting has happened since last year. Or maybe I’ve just been spoiled. Not every year can be about earth-shattering...Jul 21, 2010 · By Francoise von Trapp · 3D In-Depth
While TSVs technologies make their way out of R&D on to the manufacturing floor, improvements and developments in non-TSV 3D packaging approaches continue to make waves in the industry. It only stands to reason that for companies already involved in high-volume manufacturing either as a supplier, packaging foundry, or licensor...
